US2023405354A1PendingUtilityA1

Head assembly for a skin treatment device

Assignee: OMM IMP LLCPriority: Jun 20, 2018Filed: Sep 1, 2023Published: Dec 21, 2023
Est. expiryJun 20, 2038(~11.9 yrs left)· nominal 20-yr term from priority
Inventors:Moti Shenfarber
A61N 5/0625A61N 5/0616A61F 7/00A61N 2005/0632A61N 2005/0652A61F 2007/0071A61N 2005/0662A61N 2005/0626A61F 2007/0086A61F 2007/0088A61N 2005/0659A61B 18/203A61N 5/0622A61N 2005/0644A61F 2007/0052A61F 7/007A61N 2007/0034A61N 7/00
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Claims

Abstract

A head assembly for a skin treatment device includes a cover member for a skin treatment device passes light and heat to a user's skin. The cover member presents a comfortable flat surface at its exterior, and includes features that couple to a heating element that surrounds a plurality of visible light LEDs. The cover member can include retaining features to assist in assembling the head assembly of the skin treatment device.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A head assembly for a therapeutic device, comprising:
 a cover member having a top having a front and a back, the front being transparent and flat and configured to face outward from the therapeutic device, the back being opposite the front and having a central portion, an outside wall extending down from the front around a perimeter of the front around the entirety of the front;   a standoff portion that extends downward away from the back and which surrounds the central portion;   an outer shoulder formed between the standoff portion and a bottom of the outside wall; and   a printed circuit board (PCB) disposed at the central portion of the back of the cover member and surrounded by the standoff portion, the PCB having a plurality of light emitting diodes (LEDs) disposed on the PCB and arranged to emit light through the cover member.   
     
     
         2 . The head assembly of  claim 1 , wherein the cover member is comprised of sapphire glass. 
     
     
         3 . The head assembly of  claim 1 , wherein the cover member is comprised of silicon. 
     
     
         4 . The head assembly of  claim 1 , wherein the cover member is comprised of material that is selected to be less transparent for some wavelengths of infrared light while being more transparent for other wavelengths of infrared light. 
     
     
         5 . The head assembly of  claim 1 , wherein a surface of front of the transparent top is frosted. 
     
     
         6 . A head assembly for a skin treatment device that provides light and heat therapy to a user's skin, comprising:
 a cover member including a flat front that faces outward of the therapeutic device, and a back that is opposite the flat front, and having a central portion, an outside wall extending down from the front around a perimeter of the front around the entirety of the front, the back of the cover member having an outside shoulder formed at a bottom of the outside wall extending inward from the outside wall to an inner edge of the of the outside shoulder;   a standoff portion at the back of the cover member that extends downward away from the front and surrounds the central portion, and wherein the outside shoulder surrounds the standoff portion, an inside of the standoff portion extends downward to an inner edge of the inner shoulder, wherein the inner edge terminates at an inner wall which extends upwards to an inner surface of the top in the central portion, wherein the standoff portion extends downward, with respect to the front, farther than the outside shoulder;   the inner wall of the standoff portion defining a hollow space bounded by the inner wall and the central portion;   wherein a hollow space is formed at back that is bounded by the back at the central portion and the inner wall; and   a printed circuit board (PCB) disposed at the central portion of the back of the cover member and in the hollow space surrounded by the standoff portion, the PCB having a plurality of light emitting diodes (LEDs) disposed on the PCB and arranged to emit light through the cover member.   
     
     
         7 . The head assembly of  claim 6 , wherein the cover member is comprised of sapphire glass. 
     
     
         8 . The head assembly of  claim 6 , wherein the cover member is comprised of silicon. 
     
     
         9 . The head assembly of  claim 6 , wherein the cover member is comprised of material that is selectively transparent for selected wavelengths of infrared light. 
     
     
         10 . The head assembly of  claim 6 , wherein a surface of the transparent top and a surface of the outside wall are frosted. 
     
     
         11 . A head assembly for a skin treatment device, comprising:
 a transparent cover member having a front portion having a front surface that is configured to face outward from the skin treatment device, a back portion that is opposite the flat front portion and which includes a central portion, an outside wall portion extending down from the flat front portion around an entirety of a perimeter of the flat front portion to a corner at a bottom of the outside wall;   a standoff portion that extends downward away from the back and which surrounds the central portion;   an outer shoulder formed between the standoff portion and a bottom of the outside wall; and   a printed circuit board (PCB) disposed at the central portion of the back of the cover member and surrounded by the standoff portion, the PCB having a plurality of light emitting diodes (LEDs) disposed on the PCB and arranged to emit light through the cover member.   
     
     
         12 . The head assembly of  claim 11 , wherein the transparent cover member consists entirely of sapphire glass or silicon. 
     
     
         13 . The head assembly of  claim 11 , wherein the top of the transparent cover is frosted. 
     
     
         14 . The head assembly of  claim 11 , wherein the transparent cover is comprised of material that is selected to be less transparent for some wavelengths of infrared light while being more transparent for other wavelengths of infrared light.

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