Removal method, removal tool and semiconductor component

Abstract

A method for removing a protective film from a semiconductor component includes providing the semiconductor component having the protective film on a component upper side. The protective film protrudes beyond the component upper side at a longitudinal side. The method also includes separating the protective film from the component upper side with a removal tool which has a removal opening. The separating of the protective film from the component upper side includes guiding the removal tool next to the semiconductor component along the longitudinal side in a direction transverse to the component upper side while it bears on the protective film so that the protective film is bent by the removal tool in a direction toward a side face of the semiconductor component, and retracting the removal tool so that the protective film catches in the removal opening and the protective film is detached from the component upper side.

1 . A method for removing a protective film from a semiconductor component, having the steps:
 A) providing the semiconductor component having the protective film on a component upper side,   B) separating the protective film from the component upper side with a removal tool, which has a removal opening,   wherein the protective film in step A) protrudes beyond the component upper side at a longitudinal side, as seen in extension of the component upper side, and   wherein step B) comprises the following substeps:   B1) guiding the removal tool next to the semiconductor component along the longitudinal side in a direction transverse to the component upper side while it bears on the protective film, so that the protective film is bent by the removal tool in a direction toward a side face of the semiconductor component, and   B2) retracting the removal tool so that the protective film catches in the removal opening and the protective film is detached from the component upper side.   
     
     
         2 . The method as claimed in  claim 1 ,
 wherein the protective film in step A) is fastened on the semiconductor component by means of an adhesive, and   wherein the adhesive is applied only along two mutually opposite transverse sides of the component upper side.   
     
     
         3 . The method as claimed in  claim 1 ,
 wherein the removal opening is formed by a slot which extends along the longitudinal side, and   wherein the slot extends at an angle of at least 30° and at most 60° away from the component upper side and toward a component lower side.   
     
     
         4 . The method as claimed in  claim 1 , wherein a lower edge of the removal opening, at which there is an acute angle, is provided with at least one catching structure, which is adapted to penetrate into the protective film in step B2). 
     
     
         5 . The method as claimed in  claim 1 , wherein a shaft of the removal tool, in which the removal opening is located, is configured in one piece and mechanically rigidly. 
     
     
         6 . The method as claimed in  claim 1 , wherein a shaft of the removal tool comprises two parts that can be displaced relative to one another,
 wherein the removal opening in step B1) runs in a direction away from the component upper side through both parts, so that in step B2) the protective film is clamped between the parts.   
     
     
         7 . The method as claimed in  claim 1 ,
 wherein a shaft of the removal tool comprises two parts that can be displaced relative to one another,   wherein the removal opening in step B1) is formed by a distance between the parts parallel to a movement direction of the removal tool in step B) and the removal opening runs only partially through the shaft, so that in step B2) the protective film is clamped between the two parts.   
     
     
         8 . The method as claimed in  claim 1 , wherein the protective film in step A) protrudes beyond the component upper side only at the longitudinal side and at all other sides of the component upper side is set back relative to the component upper side as seen in a plan view. 
     
     
         9 . The method as claimed in  claim 1 , wherein the protective film consists of one of the following materials or comprises at least one of the following materials: a polyamide, a polyacrylate, a polycarbonate. 
     
     
         10 . The method as claimed in  claim 1 , wherein a ratio of a height of the removal opening and a thickness of the protective film lies between 1.2 and 4 inclusive. 
     
     
         11 . The method as claimed in  claim 1 , wherein a ratio of an overhang of the protective film beyond the longitudinal side to a thickness of the semiconductor component lies between 0.5 and 2 inclusive and/or a ratio of the overhang and a thickness of the protective film lies between 10 and 50 inclusive. 
     
     
         12 . The method as claimed in  claim 1 , wherein
 in step A) the semiconductor component is provided mounted on a carrier and a carrier frame, which forms a recess, is located on the carrier,   the semiconductor component is arranged in the recess and a distance of the semiconductor component from the carrier frame at the height of the component upper side at the longitudinal side is between 0.5 mm and 5 mm inclusive, and   in step B) the removal tool is guided between the semiconductor component and the carrier frame into the recess.   
     
     
         13 . A removal tool for a method as claimed in  claim 1 , having a shaft in which the removal opening is located, wherein
 the removal opening runs as far as a base end of the shaft, and   a length of the shaft is greater by at least a factor of 20 than a distance of the removal opening from the base end.   
     
     
         14 . A semiconductor component for a method as claimed in  claim 1 , having
 an optoelectronic semiconductor chip,   a frame, which circumferentially runs fully around the optoelectronic semiconductor chip as seen in a plan view of the component upper side, and   the protective film which is fastened on the frame and is separated from the optoelectronic semiconductor chip,   wherein the protective film protrudes beyond the component upper side at a longitudinal side, as seen in extension of the component upper side, so that the semiconductor component is bounded by the protective film at the longitudinal side as seen in a plan view of the component upper side.   
     
     
         15 . The semiconductor component as claimed in  claim 1 ,
 wherein the optoelectronic semiconductor chip has a multiplicity of pixels and is adapted for the generation of light.