Film deposition system, factory system, and method of depositing film on wafer

Abstract

A film deposition system according to the present embodiment includes a film deposition apparatus, and a computer, in which the film deposition apparatus includes a film deposition chamber in which a plurality of deposition species are installable, and the computer includes a calculation region that calculates based on a calculation model having an Ising model or QUBO, and predict a time required for film deposition when a disposition of the deposition species is set.

What is claimed is: 
     
         1 . A factory system comprising:
 a plurality of apparatuses; and   a computer, wherein   the computer includes a calculation region that calculates based on a calculation model having an Ising model or quadratic unconstrained binary optimization (QUBO), and predicts a time required for processing when the plurality of apparatuses are disposed in a plurality of regions in which the apparatuses are installable.   
     
     
         2 . The factory system according to  claim 1 , wherein the Ising model or the QUBO has first elements of a number corresponding to a product of the number of the apparatuses and the number of the apparatus installable regions, and each of the first elements is a binary variable. 
     
     
         3 . The factory system according to  claim 1 , wherein the computer further includes
 a storage region which stores a disposition of the apparatuses with respect to the regions and a time required for processing in a case of the disposition as teacher data; and   a learning region which determines an interaction parameter between elements of the Ising model or the QUBO by machine learning which is based on the teacher data and designs a calculation model.   
     
     
         4 . A method of depositing a film on a wafer comprising:
 a process of designing a calculation model having an Ising model or quadratic unconstrained binary optimization (QUBO) with a disposition of a plurality of deposition species in a film deposition apparatus as an element;   a process of predicting a time required for film deposition when the deposition species are disposed on the basis of the calculation model; and   a process of applying the disposition of the deposition species as a disposition of the deposition species of the film deposition apparatus when the predicted time is equal to or less than a predetermined time.   
     
     
         5 . The method of depositing a film on a wafer according to  claim 4 , wherein the Ising model or the QUBO has first elements of a number corresponding to a product of the number of the apparatuses and the number of the apparatus installable regions, and each of the first elements is a binary variable. 
     
     
         6 . The method of depositing a film on a wafer according to  claim 4 , wherein the process of designing a calculation model includes:
 a process of acquiring a disposition of specific deposition species and a time required for film deposition in a case of the disposition of the specific deposition species as teacher data; and   a process of determining an interaction parameter between elements by machine learning which is based on the teacher data.   
     
     
         7 . The method of depositing a film on a wafer according to  claim 5 , further comprising a process of reacquiring a disposition of the deposition species and a time required for film deposition at the time of the disposition of the deposition species when a time predicted on the basis of the calculation model is equal to or more than a predetermined time.