Holding arrangement for holding a substrate, carrier for supporting a substrate, vacuum processing system, method for holding a substrate, and method for releasing a substrate

Abstract

The present disclosure provides a holding arrangement. The holding arrangement for holding a substrate includes: a body portion having a first side; a dry adhesive material provided on the first side of the body portion; a seal surrounding the dry adhesive material and configured to provide a vacuum region on the first side, wherein the dry adhesive material is provided in the vacuum region; and a conduit to evacuate the vacuum region.

1 . A method for releasing a substrate from at least one holding arrangement, comprising:
 increasing a vacuum level in a vacuum region of the at least one holding arrangement to increase a suction force with which the substrate is pulled towards a dry adhesive material of the at least one holding arrangement, for releasing the substrate.   
     
     
         2 . The method according to  claim 1 , wherein the dry adhesive material includes a plurality of filaments, wherein the substrate is released by applying a negative pressure to the vacuum region to move the substrate closer to a body portion of the at least one holding arrangement to buckle the plurality of filaments of the dry adhesive material. 
     
     
         3 . The method according to  claim 1 , wherein increasing the vacuum level includes providing a negative pressure smaller than about 1 bar and larger than 0 bar. 
     
     
         4 . The method according to  claim 1 , wherein the dry adhesive material is a synthetic setae material and/or a Gecko adhesive. 
     
     
         5 . The method according to  claim 1 , wherein the substrate is a large area substrate of at least 0.67 m 2 . 
     
     
         6 . The method according to  claim 1 , wherein the holding arrangement includes a seal surrounding the dry adhesive material and configured to provide the vacuum region. 
     
     
         7 . The method according to  claim 1 , wherein the holding arrangement includes a conduit to evacuate the vacuum region. 
     
     
         8 . The method according to  claim 1 , wherein the releasing of the substrate is performed under non-vacuum conditions.