Wiring structure and method for manufacturing the same

Abstract

A wiring structure and a method for manufacturing the same are provided. The wiring structure includes a lower conductive structure, an upper conductive structure and a conductive via. The lower conductive structure includes a first dielectric layer and a first circuit layer in contact with the first dielectric layer. The upper conductive structure is attached to the lower conductive structure. The upper conductive structure includes a plurality of second dielectric layers, a plurality of second circuit layers in contact with the second dielectric layers, and defines an accommodating hole. An insulation material is disposed in the accommodating hole. The conductive via extends through the insulation material, and electrically connects the lower conductive structure.

What is claimed is: 
     
         1 . A wiring structure comprising:
 a lower conductive structure;   an upper conductive structure attached to the lower conductive structure, wherein the upper conductive structure includes a plurality of dielectric layers, and defines an accommodating hole; and   a plurality of conductive vias disposed within the accommodating hole.   
     
     
         2 . The wiring structure of  claim 1 , wherein the upper conductive structure further includes a plurality of circuit layers in contact with the dielectric layers. 
     
     
         3 . The wiring structure of  claim 1 , wherein the upper conductive structure further includes an insulation material disposed in the accommodating hole. 
     
     
         4 . The wiring structure of  claim 3 , wherein the plurality of conductive vias are disposed in the insulation material. 
     
     
         5 . The wiring structure of  claim 3 , wherein the upper conductive structure further includes a circuit layer embedded in the insulation material. 
     
     
         6 . The wiring structure of  claim 1 , wherein a portion of one of the plurality of conductive vias tapers away from the lower conductive structure. 
     
     
         7 . A wiring structure comprising:
 a first conductive structure; and   a second conductive structure attached to the first conductive structure, wherein the second conductive structure defines an accommodating hole for accommodating an insulation material; wherein in a cross-sectional view, a portion of the insulation material tapers toward a top surface of the insulation material.   
     
     
         8 . The wiring structure of  claim 7 , wherein a tapering direction of an inner via of the first conductive structure is opposite to a tapering direction of an inner via of the second conductive structure. 
     
     
         9 . The wiring structure of  claim 7 , further comprising a plurality of conductive vias disposed adjacent to a same lateral surface of the insulation material. 
     
     
         10 . The wiring structure of  claim 9 , wherein one of the plurality of conductive vias has a concave lateral surface. 
     
     
         11 . The wiring structure of  claim 9 , wherein a first one of the plurality of conductive vias has a first axis non-parallel with a second axis of a second one of the plurality of conductive vias. 
     
     
         12 . The wiring structure of  claim 9 , wherein a length of one of the plurality of conductive vias along a thickness direction of the second conductive structure is greater than a length of the insulation material along the thickness direction of the second conductive structure. 
     
     
         13 . The wiring structure of  claim 7 , wherein the top surface of the insulation material is exposed by a top surface of one of the plurality of dielectric layers of the second conductive structure. 
     
     
         14 . The wiring structure of  claim 7 , further comprising a conductive element encapsulated in the insulation material. 
     
     
         15 . The wiring structure of  claim 7 , wherein the top surface of the insulation material is facing away from the first conductive structure. 
     
     
         16 . A wiring structure comprising:
 a first conductive structure; and   a second conductive structure disposed over the first conductive structure, wherein the second conductive structure includes a plurality of dielectric layers, and defines an accommodating hole extending through at least one of the plurality of dielectric layers, wherein an insulation material is disposed in the accommodating hole, and covers a portion of a bottommost one of the plurality of dielectric layers.   
     
     
         17 . The wiring structure of  claim 16 , further comprising a conductive via laterally overlapping the insulation material. 
     
     
         18 . The wiring structure of  claim 17 , wherein the conductive via is electrically connected to the first conductive structure. 
     
     
         19 . The wiring structure of  claim 17 , wherein the conductive via includes a convex surface. 
     
     
         20 . The wiring structure of  claim 19 , wherein the convex surface of the conductive via is disposed on a portion of the conductive via adjacent to the first conductive structure.