US2023385750A1PendingUtilityA1
Product quality during shipping by generating lane temperature and product temperature from models
Est. expiryFeb 11, 2039(~12.5 yrs left)· nominal 20-yr term from priority
G06Q 10/0832G01K 1/02G01W 1/10G01K 7/427G01K 2207/04G01W 1/02
47
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Claims
Abstract
Systems and methods for modeling a temperature in a thermal package in a lane of commerce using forecast weather data or estimating the actual temperature history in a thermal package using actual weather data. Lane temperature is recognized and used as an intermediate calculated variable derived from weather data. Machine learning techniques estimate the lane temperature to determine a model. Product temperature in thermal packaging is estimated by simultaneously solving a set of heat transfer equations. The above is used to with forecast weather data to calculate a lane temperature and then calculate an expected product temperature based on the time and date of shipment. This product temperature curve is then analyzed with a set of decision rules to improve decision making on when to make a shipment and the best packaging to use.
Claims
exact text as granted — not AI-modified1 - 18 . (canceled)
19 . A method modeling a thermal package's heat transfer, comprising:
using a pseudo-geometry that represents three heat transfer processes in a thermal package that include (1) product to phase change material (PCM), (2) ambient temperature to product, and (3) ambient temperature to PCM; and for each of the three heat transfer processes:
positing a solution of a partial differential equation as a first order plus dead time (FOPDT) model having a gain coefficient, a time constant, and a dead time that change as the PCM in a thermal package change phase;
simultaneously solving models associated with each of the three heat transfer processes and adjusting constants associated with the gain coefficient, the time, and the dead time constants for subcooled PCM, PCMs that are changing phase, and PCMs that have fully changed phase; and
using a result to generate a package model that receives product temperature specifications and lane temperature data to determine an optimal packaging from a predetermined set of packing to be used for a shipment of the product.
20 . The method of claim 19 , wherein the package model determines if it is tuned to model a subcooled stage wherein the PCM has not begun to change phase, a melting stage wherein the PCM is changing phase, and a melted stage wherein the PCM is past its phase change point.
21 . The method of claim 20 , wherein model parameters are optimized for each of the subcooled stage, the melting stage, and the melted stage, and wherein each stage has different heat transfer characteristics.
22 . The method of claim 19 , wherein the pseudo-geometry analyses interactions between components to determine the product temperature.
23 . The method of claim 22 , wherein the interactions are described by the FOPDT model, as follows:
T
(
s
)
=
K
e
θ
τ
s
+
1
wherein T is the temperature of the product at a particular time (s), wherein K is the gain of a system, wherein Θ is the dead time that is a delay before the temperature is affected by the heat transfer, and wherein τ is the time constant that describes how quickly the temperature changes after it is exposed to something that is trying to change it.
24 . The method of claim 19 , wherein the FOPDT model is applied to individual heat transfer pathways and each pathway has its own parameters.
25 . The method of claim 24 , wherein the individual heat transfer pathways comprise:
Ambient-Product; Ambient-PCM; and PCM-Product.
26 . The method of claim 25 , further comprising defining a system as a composition of the individual heat transfer pathways represented by:
T product ( s )=( T PCM to Product ( s ))( T Ambient to PCM ( s ))+( T Ambient to Product ( s )).
27 . The method of claim 26 , wherein the system is further defined as:
τ
product
(
s
)
=
(
e
θ
1
e
θ
2
(
τ
3
s
+
1
)
+
e
θ
3
(
τ
1
s
+
1
)
(
τ
2
s
+
1
)
(
τ
1
s
+
1
)
(
τ
2
s
+
1
)
(
τ
3
s
+
1
)
)
wherein a subscript of 1 is for the PCM to product pathway, a subscript of 2 is for the ambient to PCM pathway, and a subscript of 3 is for the ambient to product pathway.
28 . The method of claim 19 , further comprising determining a stage of the PCM in a system using the pseudo-geometry.
29 . The method of claim 28 , wherein there are three stages to a container, wherein stage 1 is a consistent time delay where materials are getting to the temperature at which they will be for most of the shipment, and wherein stage 2 and stage 3 are evaluations of the system before and after the PCM changes phase.
30 . The method of claim 29 , further comprising determining the heat flowing into or out of the system over time in stage 2 or stage 3 in accordance with:
Δ H system ( t )=∫ t1 t2 T ( t )− T phase change
wherein:
ΔH(t) is the heat change in the system,
t is time, with t 2 being the final time and t 1 being the start time,
T(t) is the ambient temperature at a given time, and
T phase change is the temperature at which a PCM changes phase.
31 . The method of claim 27 further comprising, applying the following for package election:
PSRu=∫ t1 t2 T uspec −T ( t ) dt
PSRl=∫ t1 t2 T ( t )− T lspec dt
wherein PSRu is upper package suitability rating, and wherein PRl is lower package suitability ratingJoin the waitlist — get patent alerts
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