Heat dissipating apparatus and manufacturing method thereof

Abstract

A heat dissipating apparatus includes a carrier layer, a basal capillary layer and a capillary post. The carrier layer has a heat exchange surface and a carrier surface. The carrier surface faces away from the heat exchange surface. The basal capillary layer has a first surface and a second surface opposite to each other. The basal capillary layer is stacked on the carrier layer so that the first surface of the basal capillary layer contacts the carrier surface of the carrier layer. The capillary post protrudes from the second surface of the basal capillary layer.

What is claimed is: 
     
         1 . A heat dissipating apparatus, comprising:
 a carrier layer, having a heat exchange surface and a carrier surface, wherein the carrier surface faces away from the heat exchange surface;   a basal capillary layer, having a first surface and a second surface opposite to each other, wherein the basal capillary layer is stacked on the carrier layer so that the first surface of the basal capillary layer contacts the carrier surface of the carrier layer; and   a capillary post, protruding from the second surface of the basal capillary layer.   
     
     
         2 . The heat dissipating apparatus according to  claim 1 , wherein the carrier layer is a metal sheet. 
     
     
         3 . The heat dissipating apparatus according to  claim 1 , wherein the basal capillary layer is a metal mesh. 
     
     
         4 . The heat dissipating apparatus according to  claim 3 , wherein the basal capillary layer is a copper mesh. 
     
     
         5 . The heat dissipating apparatus according to  claim 1 , wherein the basal capillary layer is a metal powder post. 
     
     
         6 . The heat dissipating apparatus according to  claim 1 , wherein the capillary post is a metal powder post. 
     
     
         7 . The heat dissipating apparatus according to  claim 1 , wherein a mesh number of the basal capillary layer is greater than or equal to 60 and less than or equal to 500. 
     
     
         8 . The heat dissipating apparatus according to  claim 1 , wherein a diameter of the capillary post is greater than or equal to 0.5 millimeters and less than or equal to 30 millimeters. 
     
     
         9 . The heat dissipating apparatus according to  claim 1 , wherein a porosity of the capillary post is greater than or equal to 0% and less than or equal to 50%. 
     
     
         10 . A manufacturing method of a heat dissipating apparatus, comprising:
 sintering a basal capillary layer on a carrier layer; and   extruding a metal powder to form at least one capillary post on the basal capillary layer.   
     
     
         11 . The manufacturing method of the heat dissipating apparatus according to  claim 10 , wherein the basal capillary layer is a metal mesh. 
     
     
         12 . The manufacturing method of the heat dissipating apparatus according to  claim 11 , wherein the basal capillary layer is a copper mesh. 
     
     
         13 . The manufacturing method of the heat dissipating apparatus according to  claim 10 , wherein a mesh number of the basal capillary layer is greater than or equal to 60 and less than or equal to 500. 
     
     
         14 . The manufacturing method of the heat dissipating apparatus according to  claim 10 , wherein a diameter of the capillary post is greater than or equal to 0.5 millimeters and less than or equal to 30 millimeters. 
     
     
         15 . The manufacturing method of the heat dissipating apparatus according to  claim 10 , wherein a porosity of the capillary post is greater than or equal to 0% and less than or equal to 50%. 
     
     
         16 . The manufacturing method of the heat dissipating apparatus according to  claim 10 , wherein the metal powder is a powder particle having a mesh number greater than or equal to 500 and a diameter greater than or equal to 25 micrometers. 
     
     
         17 . A heat dissipating apparatus, comprising:
 a casing, comprising a first heat conduction case and a second heat conduction case, wherein the second heat conduction case is coupled to the first heat conduction case so that the second heat conduction case and the first heat conduction case together form a chamber; and   a composite capillary structure, located in the chamber, comprising:
 two basal capillary layers, each having a first surface and a second surface opposite to each other, wherein the first surfaces of the two basal capillary layers are respectively connected to the first heat conduction case and the second heat conduction case; and 
 a plurality of capillary posts, having two opposite ends respectively connected to the second surfaces of the two basal capillary layers. 
   
     
     
         18 . The heat dissipating apparatus according to  claim 17 , wherein each of the basal capillary layer is a metal mesh. 
     
     
         19 . The heat dissipating apparatus according to  claim 17 , wherein each of the basal capillary layer is a metal powder post. 
     
     
         20 . The heat dissipating apparatus according to  claim 17 , wherein each of the capillary post is a metal powder post. 
     
     
         21 . The heat dissipating apparatus according to  claim 17 , wherein a mesh number of each the basal capillary layer is greater than or equal to 60 and less than or equal to 500. 
     
     
         22 . The heat dissipating apparatus according to  claim 17 , wherein a diameter of each the capillary post is greater than or equal to 0.5 millimeters and less than or equal to 30 millimeters. 
     
     
         23 . The heat dissipating apparatus according to  claim 17 , wherein a porosity of each the capillary post is greater than or equal to 0% and less than or equal to 50%.