Substrate holder, apparatus for plating, and method of manufacturing apparatus for plating

Abstract

There is provided a substrate holder configured to hold a substrate in an apparatus for plating. The substrate holder comprises a seal configured to seal an outer peripheral part of the substrate and provided with a first opening which a surface to be plated or a plating surface of the substrate is exposed on; and a seal ring holder configured to hold the seal and provided with a second opening which the plating surface of the substrate is exposed on, wherein an opening diameter ratio that is a ratio of an opening diameter of the second opening to an opening diameter of the first opening is in a range of not lower than 99.32% and not higher than 99.80%.

1 . A substrate holder configured to hold a substrate in an apparatus for plating, the substrate holder comprising:
 a seal configured to seal an outer peripheral part of the substrate and provided with a first opening which a surface to be plated or a plating surface of the substrate is exposed on; and   a seal ring holder configured to hold the seal and provided with a second opening which the plating surface of the substrate is exposed on,   wherein an opening diameter ratio that is a ratio of an opening diameter of the second opening to an opening diameter of the first opening is in a range of not lower than 99.32% and not higher than 99.80%.   
     
     
         2 . The substrate holder according to  claim 1 ,
 wherein the opening diameter ratio is in a range of not lower than 99.42% and not higher than 99.59%.   
     
     
         3 . The substrate holder according to  claim 1 ,
 wherein the second opening of the seal ring holder has a first taper on a side away from the seal, wherein   the first taper is provided to increase a diameter of the second opening in a direction farther away from the seal.   
     
     
         4 . The substrate holder according to  claim 1 ,
 wherein the second opening of the seal ring holder has a second taper on a side close to the seal, wherein   the second taper is provided to increase a diameter of the second opening in a direction closer to the seal.   
     
     
         5 . The substrate holder according to  claim 1 ,
 wherein the second opening of the seal ring holder has a first taper on a side away from the seal and a second taper on a side close to the seal, wherein   the first taper is provided to increase a diameter of the second opening in a direction farther away from the seal, and   the second taper is provided to increase a diameter of the second opening in a direction closer to the seal.   
     
     
         6 . A substrate holder configured to hold a substrate in an apparatus for plating, the substrate holder comprising:
 a seal configured to seal an outer peripheral part of the substrate and provided with a first opening which a surface to be plated or a plating surface of the substrate is exposed on; and   a seal ring holder configured to hold the seal and provided with a second opening which the plating surface of the substrate is exposed on,   wherein the second opening of the seal ring holder has a first taper provided on a side away from the seal and/or a second taper provided on a side close to the seal, wherein   the first taper is provided to increase a diameter of the second opening in a direction farther away from the seal, and   the second taper is provided to increase a diameter of the second opening in a direction closer to the seal.   
     
     
         7 . The substrate holder according to  claim 1 ,
 the substrate holder holding the substrate in such a manner that the plating surface of the substrate faces down.   
     
     
         8 . The substrate holder according to  claim 1 ,
 the substrate holder holding the substrate in such a manner that the plating surface of the substrate stands up.   
     
     
         9 . An apparatus for plating, comprising:
 the substrate holder according to  claim 1 ; and   a plating tank which the substrate holder is placed in.   
     
     
         10 . A method of manufacturing an apparatus for plating provided with a substrate holder configured to hold a substrate, the method comprising:
 assembling a seal that is provided with a first opening and that is configured to seal an outer peripheral part of the substrate, and a seal ring holder that is provided with a second opening and that is configured to hold the seal, wherein   the assembling the seal and the seal ring holder comprises selecting the seal ring holder and the seal, such that an opening diameter ratio that is a ratio of an opening diameter of the second opening of the seal ring holder to an opening diameter of the first opening of the seal is in a range of not lower than 99.32% and not higher than 99.80%.   
     
     
         11 . The substrate holder according to  claim 6 ,
 the substrate holder holding the substrate in such a manner that the plating surface of the substrate faces down.   
     
     
         12 . The substrate holder according to  claim 6 ,
 the substrate holder holding the substrate in such a manner that the plating surface of the substrate stands up.   
     
     
         13 . An apparatus for plating, comprising:
 the substrate holder according to  claim 6 ; and   a plating tank which the substrate holder is placed in.