Resin composition and article made therefrom

Abstract

A resin composition includes 100 parts by weight of a vinyl group-containing polyphenylene ether resin, 10 parts by weight to 20 parts by weight of a polyolefin, 15 parts by weight to 45 parts by weight of a first phosphorus-containing compound and 5 parts by weight to 15 parts by weight of a second phosphorus-containing compound, wherein the polyolefin includes a styrene-butadiene-maleic anhydride terpolymer or a butadiene-maleic anhydride copolymer, the first phosphorus-containing compound includes a compound of Formula (I), and the second phosphorus-containing compound includes a compound of Formula (II), a compound of Formula (III) or a combination thereof. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including difference rate of dissipation factor before and after 24 hours of water absorption, Z-axis coefficient of thermal expansion and dissipation factor after 24 hours of water absorption.

What is claimed is: 
     
         1 . A resin composition, comprising 100 parts by weight of a vinyl group-containing polyphenylene ether resin, 10 parts by weight to 20 parts by weight of a polyolefin, 15 parts by weight to 45 parts by weight of a first phosphorus-containing compound and 5 parts by weight to 15 parts by weight of a second phosphorus-containing compound, wherein:
 the polyolefin comprises a styrene-butadiene-maleic anhydride terpolymer or a butadiene-maleic anhydride copolymer;   the first phosphorus-containing compound comprises a compound of Formula (I):   
       
         
           
           
               
               
           
         
         wherein any one, two or three of R 1  to R 6  are a p-vinylphenoxy group, and the remaining are a phenoxy group; and 
         the second phosphorus-containing compound comprises a compound of Formula (II), a compound of Formula (III), or a combination thereof: 
       
       
         
           
           
               
               
           
         
       
       
         
           
           
               
               
           
         
       
     
     
         2 . The resin composition of  claim 1 , wherein the vinyl group-containing polyphenylene ether resin comprises a vinylbenzyl group-containing biphenyl polyphenylene ether resin, a methacrylate group-containing polyphenylene ether resin or a combination thereof. 
     
     
         3 . The resin composition of  claim 1 , wherein the first phosphorus-containing compound comprises a compound of Formula (IV), a compound of Formula (V), a compound of Formula (VI) or a combination thereof: 
       
         
           
           
               
               
           
         
       
     
     
         4 . The resin composition of  claim 1 , further comprising maleimide resin, acenaphthylene or a combination thereof. 
     
     
         5 . The resin composition of  claim 1 , further comprising inorganic filler, flame retardant, curing accelerator, polymerization inhibitor, solvent, silane coupling agent, coloring agent, toughening agent or a combination thereof. 
     
     
         6 . An article made from the resin composition of  claim 1 , comprising a prepreg, a resin film, a laminate or a printed circuit board. 
     
     
         7 . The article of  claim 6 , having a difference rate of dissipation factor of less than or equal to 83% calculated according to a dissipation factor as measured by reference to JIS C2565 at 10 GHz before and after 24 hours of water absorption performed at a constant temperature by reference to JIS C6481. 
     
     
         8 . The article of  claim 6 , having a Z-axis coefficient of thermal expansion as measured by reference to IPC-TM-650 2.4.24.5 of less than or equal to 32 ppm/° C. 
     
     
         9 . The article of  claim 6 , having a dissipation factor of less than or equal to 0.0049 as measured by reference to JIS C2565 at 10 GHz after 24 hours of water absorption performed at a constant temperature by reference to JIS C6481.