Electronic device

Abstract

An electronic device is disclosed. The electronic device includes a circuit structure. The circuit structure includes a metal member and an insulating layer. The insulating layer surrounds the metal member and includes at least one recess. The metal member corresponds to the recess, the recess exposes a surface of the metal member, and a width of the recess is greater than a width of the metal member in a cross-sectional view of the metal member and the insulating layer.

What is claimed is: 
     
         1 . An electronic device comprising a circuit structure, wherein the circuit structure comprising:
 a metal member; and   an insulating layer surrounding the metal member and comprising at least one recess,   wherein the metal member corresponds to one of the at least one of the recess, the one of the at least one of the recess exposes a surface of the metal member, and a width of the one of the at least one recess is greater than a width of the metal member in a cross-sectional view of the metal member and the insulating layer.   
     
     
         2 . The electronic device according to  claim 1 , wherein the insulating layer comprises a single layer structure or a multilayer structure. 
     
     
         3 . The electronic device according to  claim 2 , wherein the insulating layer comprises organic insulating materials or inorganic insulating materials. 
     
     
         4 . The electronic device according to  claim 1 , wherein the metal member comprises a first part and a second part, the one of the at least one of the recess exposes the first part of the metal member, and a width of the first part is different from a width of the second part. 
     
     
         5 . The electronic device according to  claim 1 , wherein the circuit structure is a redistribution layer structure. 
     
     
         6 . The electronic device according to  claim 1 , wherein the metal member comprises:
 a first part comprising a first side surface;   a second part disposed on the first part and comprising a second side surface; and   an another surface connecting between the first side surface and the second side surface, wherein a distance exists between the first side surface and the second side surface along a direction perpendicular to a normal direction of the electronic device in the cross-sectional view of the metal member and the insulating layer.   
     
     
         7 . The electronic device according to  claim 6 , wherein the first side surface and the second side surface are located on a same side of the metal member. 
     
     
         8 . The electronic device according to  claim 6 , wherein the first side surface, the second side surface and the another surface define a side surface of the metal member, and the side surface of the metal member has a step-like shape. 
     
     
         9 . The electronic device according to  claim 1 , wherein the insulating layer is directly connected with the metal member.