Integrated connector port module
Abstract
A connector port module and a method of manufacturing the same. The connector port module includes a circuit board, with a connector having a plurality of connector pads formed on the circuit board configured to electrically connect to a mating connector. At least one via hole is formed in the circuit board for reinforcing the physical integrity and the heat diffusivity of the circuit board. The connector port module is capable of supporting Universal Serial Bus (USB) (e.g. USB-C) and Thunderbolt 3 connectors. The method includes: providing a circuit board; forming a plurality of connector pads on the circuit board configured to electrically connect to a mating connector; and forming at least one via hole for reinforcing physical integrity of the circuit board.
Claims
exact text as granted — not AI-modified1 . A connector port module, comprising:
a circuit board including a first portion, a second portion, and a rigid integrated connection joint in between the first portion and the second portion; a connector having a plurality of connector pads formed on the circuit board configured to electrically connect to a mating connector, wherein the plurality of connector pads are formed on the first portion of the circuit board; and at least one via hole formed in the circuit board, wherein at least one of the via holes is formed at the rigid integrated connection joint and is unoccupied for providing physical reinforcement to the circuit board.
2 . The connector port module of claim 1 , the at least one of the via holes formed at the rigid integrated connection joint is unoccupied by any wires or leads for the providing physical reinforcement.
3 . The connector port module of claim 1 , wherein the connector is a Universal Serial Bus (USB) connector.
4 . The connector port module of claim 3 , wherein the USB connector is a USB-Type C (USB-C) connector, and the plurality of connector pads comprise 24 connector pads.
5 . The connector port module of claim 1 , wherein the circuit board is an integrated printed circuit board (PCB).
6 . The connector port module of claim 1 , wherein the at least one via hole includes a plurality of via holes, wherein the plurality of via holes run from the plurality of connector pads to the rigid integrated connection joint.
7 . The connector port module of claim 1 , wherein the first portion is a tongue portion.
8 . The connector port module of claim 1 , wherein the at least one via hole is coated with an electrically conductive material with tensile strength greater than that of the circuit board.
9 . The connector port module of claim 8 , wherein the electrically conductive material is copper.
10 . The connector port module of claim 1 , wherein the at least one via hole is gold plated.
11 . The connector port module of claim 1 , wherein the at least one via hole is located in close proximity to a power pin of the plurality of connector pads to dissipate heat generated in the power pin.
12 . The connector port module of claim 1 , wherein the second portion of the circuit board includes two arm portions flanking the first portion with a gap formed in between the arm portion and the first portion, the gap is dimensioned to receive an external connector.
13 . The connector port module of claim 1 , further comprising a shell that provides passive or active shielding to the connector.
14 . The connector port module of claim 1 , wherein the first portion is hourglass shaped with two mating grooves.
15 . The connector port module of claim 1 , wherein the at least one via hole is electrically isolated from signal traces or other components of the connector port module.
16 . The connector port module of claim 1 , wherein the at least one of the via holes formed at the rigid integrated connection joint comprises at least two of the via holes that are unoccupied.
17 . A method of manufacturing a connector port module, comprising:
providing a circuit board having a first portion, a second portion, and a rigid integrated connection joint in between the first portion and the second portion; forming a plurality of connector pads on the first portion of the circuit board configured to electrically connect to a mating connector; and forming a plurality of via holes, comprising forming at least one of the via holes at the rigid integrated connection joint, wherein the at least one of the via holes at the rigid integrated connection joint is unoccupied for reinforcing physical integrity of the circuit board.
18 . The method of claim 17 , wherein the at least one via hole formed at the rigid integrated connection joint is unoccupied by any wires or leads for the reinforcing physical integrity.
19 . The method of claim 17 , wherein the forming of the at least one via hole are formed without obstructing signal trace matching and are electrically isolated from signal traces of the circuit board.
20 . The method of claim 17 , wherein the at least one of the via holes formed at the rigid integrated connection joint comprises at least two of the via holes that are unoccupied.Join the waitlist — get patent alerts
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