Removal of wires from packaging substrates

Abstract

Wire removal systems and methods for packaging applications. In some embodiments, a method of manufacturing a module can include providing a packaging substrate including a die mounted on the packaging substrate and a plurality of defective wires coupled to the packaging substrate. The method can include executing in response to a trigger, by an automated wire cutting apparatus without user input, a set of stored instructions to position a wire cutting instrument of the automated wire cutting apparatus and a first defective wire of the plurality of defective wires adjacent to one another, and sequentially detach the plurality of defective wires from the packaging substrate using the wire cutting instrument.

What is claimed is: 
     
         1 . A method of manufacturing a module, the method comprising:
 providing a packaging substrate including a die mounted on the packaging substrate and a plurality of defective wires coupled to the packaging substrate; and   executing in response to a trigger, by an automated wire cutting apparatus without user input, a set of stored instructions to:
 position a wire cutting instrument of the automated wire cutting apparatus and a first defective wire of the plurality of defective wires adjacent to one another, and 
 sequentially detach the plurality of defective wires from the packaging substrate using the wire cutting instrument. 
   
     
     
         2 . The method of  claim 1  wherein executing in response to the trigger, by the automated wire cutting apparatus without user input, the set of stored instructions to position the wire cutting instrument includes moving the packaging substrate to position the first defective wire adjacent to the wire cutting instrument. 
     
     
         3 . The method of  claim 1  wherein executing in response to the trigger, by the automated wire cutting apparatus without user input, the set of stored instructions to position the wire cutting instrument includes moving the wire cutting instrument to position the wire cutting instrument adjacent to the first defective wire. 
     
     
         4 . The method of  claim 1  wherein executing in response to the trigger, by the automated wire cutting apparatus without user input, the set of stored instructions to sequentially detach the plurality of defective wires includes moving the wire cutting instrument relative to the packaging substrate while the packaging substrate is stationary. 
     
     
         5 . The method of  claim 4  wherein moving the wire cutting instrument includes moving the wire cutting instrument along a linear path. 
     
     
         6 . The method of  claim 1  wherein executing in response to the trigger, by the automated wire cutting apparatus without user input, the set of stored instructions to sequentially detach the plurality of defective wires from the packaging substrate includes sequentially contacting the wire cutting instrument and each of the plurality of defective wires to mechanically separate the plurality of defective wires. 
     
     
         7 . The method of  claim 6  wherein sequentially contacting the wire cutting instrument and each of the plurality of defective wires includes maintaining contact between the wire cutting instrument and each of the plurality of defective wires to apply a shear force upon each defective wire to mechanically separate each defective wire from the packaging substrate. 
     
     
         8 . The method of  claim 1  further comprising removing by the automated wire cutting apparatus each detached defective wire. 
     
     
         9 . The method of  claim 8  wherein removing each detached defective wire includes shaking the packaging substrate. 
     
     
         10 . The method of  claim 1  wherein the plurality of defective wires includes at least one of an extraneous wire, a wire having an erroneous diameter, a wire having a defective loop, and an erroneously positioned wire. 
     
     
         11 . An automated wire cutting apparatus comprising:
 a packaging substrate receptacle configured to hold a packaging substrate having a die mounted on the packaging substrate and a plurality of defective wires coupled to the packaging substrate; and   a wire cutting instrument, the apparatus being configured to execute a set of stored instructions, in response to a trigger and without user input, to position the wire cutting instrument and a first defective wire of the plurality of defective wires adjacent to one another and to sequentially detach the plurality of defective wires from the packaging substrate.   
     
     
         12 . The apparatus of  claim 11  wherein the apparatus is configured to move the packaging substrate to position the first defective wire adjacent to the wire cutting instrument. 
     
     
         13 . The apparatus of  claim 11  wherein the apparatus is configured to move the wire cutting instrument to position the wire cutting instrument adjacent to the first defective wire. 
     
     
         14 . The apparatus of  claim 11  wherein the apparatus is configured to move the wire cutting instrument relative to the packaging substrate while the packaging substrate is stationary to sequentially detach the plurality of defective wires. 
     
     
         15 . The apparatus of  claim 14  wherein the apparatus is configured to move the wire cutting instrument along a linear path. 
     
     
         16 . The apparatus of  claim 11  wherein the wire cutting instrument includes a wire cutting shank portion and a wire cutting tip portion extending from a distal end of the wire cutting shank portion. 
     
     
         17 . The apparatus of  claim 16  wherein the wire cutting instrument includes a shear tool configured to contact each defective wire and apply a shear force upon each defective wire to effect separation of each defective wire from the packaging substrate. 
     
     
         18 . The apparatus of  claim 11  further comprising a packaging substrate shaker configured to shake the packaging substrate to remove detached defective wires. 
     
     
         19 . The apparatus of  claim 18  wherein the packaging substrate shaker includes a packaging substrate shaker receptacle configured to receive the packaging substrate, the packaging substrate shaker being configured to cause the packaging substrate receptacle to vibrate. 
     
     
         20 . The apparatus of  claim 11  wherein the apparatus is configured to detach at least one of an extraneous wire, a wire having an erroneous diameter, a wire having a defective loop, and an erroneously positioned wire from the packaging substrate.