Thermally conductive resin composition and electronic device

Abstract

The thermally conductive resin composition containing: 5 to 95 parts by weight of a copolymer (a) having a (meth)acrylic monomer unit A having an anionic group, a (meth)acrylic monomer unit B having a cationic group, and a silicone (meth)acrylic monomer unit C; 95 to 5 parts by weight of a silicone resin (b); and 500 to 3000 parts by weight of a thermally conductive filler (c) having a thermal conductivity of 10 W/mK or more, wherein a total content of the copolymer (a) and the silicone resin (b) is 100 parts by weight, and the silicone resin (b) includes a crosslinked silicone resin (b-1), wherein a content of the crosslinked silicone resin (b-1) is 5 to 100 mass % based on the total amount of the silicone resin (b).

1 . A thermally conductive resin composition comprising:
 5 to 95 parts by weight of a copolymer (a) having a (meth)acrylic monomer unit A having an anionic group, a (meth)acrylic monomer unit B having a cationic group, and a silicone (meth)acrylic monomer unit C;   95 to 5 parts by weight of a silicone resin (b); and   500 to 3000 parts by weight of a thermally conductive filler (c) having a thermal conductivity of 10 W/mK or more, wherein   a total content of the copolymer (a) and the silicone resin (b) is 100 parts by weight, and   the silicone resin (b) comprises a crosslinked silicone resin (b-1), wherein   a content of the crosslinked silicone resin (b-1) is 5 to 100 mass % based on the total amount of the silicone resin (b).   
     
     
         2 . The thermally conductive resin composition according to  claim 1 , wherein
 the silicone resin (b) further comprises a non-crosslinked silicone resin (b-2), wherein   the content of the crosslinked silicone resin (b-1) is 5 to 99 mass % based on the total amount of the silicone resin (b), and   a content of the non-crosslinked silicone resin (b-2) is 95 to 1 mass % based on the total amount of the silicone resin (b).   
     
     
         3 . The thermally conductive resin composition according to  claim 2 , wherein the non-crosslinked silicone resin (b-2) is linear polyorganosiloxane. 
     
     
         4 . The thermally conductive resin composition according to  claim 2 , wherein
 a viscosity of the non-crosslinked silicone resin (b-2) is 1 to 10,000 mPa·s as a value measured at a shear velocity of 10 sec −1  at 25° C.   
     
     
         5 . The thermally conductive resin composition according to  claim 1 , wherein
 the crosslinked silicone resin (b-1) is prepared through the reaction between polyorganosiloxane (b-1-1) having two or more alkenyl groups in a molecule and polyorganosiloxane (b-1-2) containing two or more SiH groups in a molecule.   
     
     
         6 . The thermally conductive resin composition according to  claim 1 , wherein
 the anionic group comprises one or more selected from the group consisting of carboxy groups, phosphate groups, and phenolic hydroxy groups.   
     
     
         7 . The thermally conductive resin composition according to  claim 1 , wherein
 the (meth)acrylic monomer unit A further has an electron-withdrawing group bound to the anionic group.   
     
     
         8 . The thermally conductive resin composition according to  claim 1 , wherein
 the cationic group comprises one or more selected from the group consisting of primary amino groups, secondary amino groups, tertiary amino groups, and quaternary ammonium salts.   
     
     
         9 . The thermally conductive resin composition according to  claim 1 , wherein
 the (meth)acrylic monomer unit B further has an electron-donating group bound to the cationic group.   
     
     
         10 . The thermally conductive resin composition according to  claim 1 , wherein
 a weight average molecular weight of the copolymer (a) is 5,000 to 500,000.   
     
     
         11 . The thermally conductive resin composition according to  claim 1 , wherein
 a total content of the (meth)acrylic monomer unit A and the (meth)acrylic monomer unit B is 0.05 to 90 mol % based on the total 100 mol % of the (meth)acrylic monomer unit A, the (meth)acrylic monomer unit B, and the silicone (meth)acrylic monomer unit C.   
     
     
         12 . The thermally conductive resin composition according to  claim 1 , wherein
 a content of the (meth)acrylic monomer unit A is 0.03 to 85 mol % based on the total 100 mol % of the (meth)acrylic monomer unit A, the (meth)acrylic monomer unit B, and the silicone (meth)acrylic monomer unit C.   
     
     
         13 . The thermally conductive resin composition according to  claim 1 , wherein
 a content of the (meth)acrylic monomer unit B is 0.1 to 10 mol % based on the total 100 mol % of the (meth)acrylic monomer unit A, the (meth)acrylic monomer unit B, and the silicone (meth)acrylic monomer unit C.   
     
     
         14 . The thermally conductive resin composition according to  claim 1 , wherein
 a content of the silicone (meth)acrylic monomer unit C is 10 to 99.5 mol % based on the total 100 mol % of the (meth)acrylic monomer unit A, the (meth)acrylic monomer unit B, and the silicone (meth)acrylic monomer unit C.   
     
     
         15 . The thermally conductive resin composition according to  claim 1 , wherein
 a molar ratio of the (meth)acrylic monomer unit A to the (meth)acrylic monomer unit B is 0.01 to 50.   
     
     
         16 . The thermally conductive resin composition according to  claim 1 , comprising
 0.01 to 5 parts by weight of a surface treatment agent (d) based on 100 parts by weight of the thermally conductive filler (c).   
     
     
         17 . The thermally conductive resin composition according to  claim 1 , wherein
 the thermally conductive filler (c) is one or more selected from among aluminum, aluminum hydroxide, aluminum oxide, aluminum nitride, boron nitride, zinc oxide, magnesium oxide, and diamond.   
     
     
         18 . An electronic device comprising
 a heat generator, a heat sink, and the thermally conductive resin composition according to  claim 1  or a hardened product thereof, wherein   the thermally conductive resin composition or the hardened product is disposed between the heat generator and the heat sink.