Chemical Mechanical Polishing Apparatus Including a Multi-Zone Platen

Abstract

A chemical mechanical planarization apparatus includes a multi-zone platen comprising a plurality of individually controlled concentric toroids. The rotation direction, rotation speed, applied force, relative height, and temperature of each concentric toroid is individually controlled. Concentric polishing pads are affixed to an upper surface of each of the individually controlled concentric toroids. The chemical mechanical planarization apparatus includes a single central slurry source or includes individual slurry sources for each individually controlled concentric toroid.

What is claimed is: 
     
         1 . A chemical mechanical planarization apparatus comprising:
 a first toroidal platen section configured to hold a first polishing pad to remove material from a wafer, wherein the first toroidal platen section has a first thickness; and   a second toroidal platen section configured to hold a second polishing pad to remove material from the wafer, wherein the first toroidal platen section is nested within the second toroidal platen section, wherein the first toroidal platen section is independently movable from the second toroidal platen section, wherein the second toroidal platen section has a second thickness different from the first thickness.   
     
     
         2 . The chemical mechanical planarization apparatus of  claim 1 , wherein the first thickness is 10% to 300% of the second thickness. 
     
     
         3 . The chemical mechanical planarization apparatus of  claim 1 , wherein the first toroidal platen section has a disc shape in a top view, and the second toroidal platen section has a ring shape in the top view. 
     
     
         4 . The chemical mechanical planarization apparatus of  claim 1 , further comprising a third toroidal platen section laterally encircling the first toroidal platen section and the second toroidal platen section, wherein the third toroidal platen section has a third thickness different from the first thickness and the second thickness. 
     
     
         5 . The chemical mechanical planarization apparatus of  claim 1 , further comprising a platen carrier, wherein the platen carrier has a height greater than the height of the first toroidal platen section and the height of the second toroidal platen section. 
     
     
         6 . The chemical mechanical planarization apparatus of  claim 5 , wherein the platen carrier has a bottom that provides vertical support for the first toroidal platen section and the second toroidal platen section. 
     
     
         7 . The chemical mechanical planarization apparatus of  claim 6 , further comprising a force component configured to apply force to the first toroidal platen section and the second toroidal platen section, a rotation component configured to apply rotation to the first toroidal platen section and the second toroidal platen section, a slurry component configured to provide a slurry to the first toroidal platen section and the second toroidal platen section, and a temperature component configured to control temperatures of the first toroidal platen section and the second toroidal platen section, wherein the force component, the rotation component, the slurry component, and the temperature component penetrate through the bottom of the platen carrier. 
     
     
         8 . A chemical mechanical planarization apparatus comprising:
 a platen comprising a plurality of concentric toroids, wherein at least one of a rotation direction, rotation speed, force, relative height, or temperature of each concentric toroid is individually controlled, wherein an innermost one of the concentric toroids has a disc shape in a top view; and   a plurality of concentric polishing pad sections, wherein each one of the plurality of concentric polishing pad sections is affixed to a respective one of the plurality of concentric toroids.   
     
     
         9 . The chemical mechanical planarization apparatus of  claim 8 , wherein the plurality of concentric toroids comprises at least three concentric toroids. 
     
     
         10 . The chemical mechanical planarization apparatus of  claim 8 , wherein at least two of the plurality of concentric polishing pad sections have a ring shape in a top view with different thicknesses. 
     
     
         11 . The chemical mechanical planarization apparatus of  claim 8 , further comprising multiple dispensing tubes connected to a slurry supply, wherein at least one of the dispensing tubes extends into a gap between two of the concentric toroids. 
     
     
         12 . The chemical mechanical planarization apparatus of  claim 8 , wherein all of the plurality of concentric toroids have a same height. 
     
     
         13 . The chemical mechanical planarization apparatus of  claim 8 , further comprising a platen carrier, wherein the platen carrier has a height greater than each height of the plurality of the concentric toroids. 
     
     
         14 . The chemical mechanical planarization apparatus of  claim 13 , wherein the platen carrier has a bottom that provides vertical support to the plurality of concentric toroids. 
     
     
         15 . A chemical mechanical planarization apparatus comprising:
 a first toroidal platen section configured to hold a first polishing pad to remove material from a wafer;   a second toroidal platen section configured to hold a second polishing pad to remove a material from the wafer, wherein the first toroidal platen section is nested within the second toroidal platen section and wherein the first toroidal platen section is independently movable from the second toroidal platen section;   a first slurry supply line extending through the first toroidal platen section; and   a second slurry supply line extending to a gap between the first toroidal platen section and the second toroidal platen section.   
     
     
         16 . The chemical mechanical planarization apparatus of  claim 15 , wherein the first slurry supply line is configured to supply a slurry onto a surface of the first polishing pad over the first toroidal platen section. 
     
     
         17 . The chemical mechanical planarization apparatus of  claim 15 , wherein the second slurry supply line is configured to supply a slurry onto a surface of the first polishing pad over the first toroidal platen section and a surface of the second polishing pad over the second toroidal platen section. 
     
     
         18 . The chemical mechanical planarization apparatus of  claim 15 , further comprising a platen carrier, and the first toroidal platen section and the second toroidal platen section are nested in the platen carrier, wherein the platen carrier has a height greater than the height of the first toroidal platen section and the height of the second toroidal platen section. 
     
     
         19 . The chemical mechanical planarization apparatus of  claim 18 , wherein the platen carrier has a bottom that provides vertical support for the first toroidal platen section and the second toroidal platen section. 
     
     
         20 . The chemical mechanical planarization apparatus of  claim 19 , wherein the platen carrier provides lateral support for the first toroidal platen section and the second toroidal platen section.