Method of manufacturing electronic device

Abstract

A method of manufacturing an electronic device includes providing a substrate, providing an electronic unit having a chip and at least one bonding pin is provided, mounting the electronic unit on the substrate through the at least one bonding pin, and applying an adhesive material into a space between the chip and the substrate by a coating process after mounting the electronic unit on the substrate.

What is claimed is: 
     
         1 . A method of manufacturing an electronic device, comprising:
 providing a substrate ( 110 );   providing an electronic unit ( 121 ) having a chip ( 121 C) and at least one bonding pin ( 121 A);   mounting the electronic unit ( 121 ) on the substrate ( 110 ) through the at least one bonding pin ( 121 A); and   applying an adhesive material ( 130 ) into a space ( 121 S) between the chip and the substrate by a coating process after mounting the electronic unit on the substrate.   
     
     
         2 . The method according to  claim 1 , further comprising:
 curing the adhesive material.   
     
     
         3 . The method according to  claim 2 , wherein the adhesive material is cured by a heating process. 
     
     
         4 . The method according to  claim 1 , wherein the adhesive material covers a top surface ( 121 T) of the electronic unit, and a light transmittance of the adhesive material is greater than or equal to 95%. 
     
     
         5 . The method according to  claim 1 , wherein the electronic device is bonded to an optical substrate ( 130 A) with another adhesive material ( 160 ). 
     
     
         6 . The method according to  claim 5 , wherein the optical substrate comprises a color conversion layer, a color filter layer ( 162 A), and a bank ( 163 ) disposed besides the color conversion layer and the color filter layer. 
     
     
         7 . The method according to  claim 1 , wherein the space between the chip and the substrate is less than or equal to 3 micrometers. 
     
     
         8 . The method according to  claim 1 , wherein the substrate comprises a pixel defining layer ( 154 ), the electronic unit is located besides the pixel defining layer, and the adhesive material is applied into a gap between the electronic unit and the pixel defining layer. 
     
     
         9 . The method according to  claim 8 , wherein the gap between the electronic unit and the pixel defining layer is less than 10 μm. 
     
     
         10 . The method according to  claim 1 , wherein the adhesive material has a viscosity in a range from 8 cP to 12 cP. 
     
     
         11 . The method according to  claim 1 , wherein a light transmittance of the adhesive material is greater than or equal to 95%. 
     
     
         12 . The method according to  claim 1 , wherein a top surface of the adhesive material is lower than a top surface of the electronic unit. 
     
     
         13 . The method according to  claim 1 , wherein the electronic unit comprises a light emitting diode.