Wafer holder

Abstract

A wafer holder comprising: a ceramic base having a wafer-mounting surface as an upper surface; and a conductive member embedded in the ceramic base, the conductive member including a circuit portion provided parallel to the wafer-mounting surface, a pull-out portion provided parallel to the wafer-mounting surface and spaced from the circuit portion in a direction opposite to a direction toward the wafer-mounting surface, and a connecting portion configured to electrically connect the circuit portion and the pull-out portion to each other.

1 . A wafer holder comprising:
 a ceramic base having a wafer-mounting surface as an upper surface;   a conductive member embedded in the ceramic base,   the conductive member including
 a circuit portion provided parallel to the wafer-mounting surface, 
 a pull-out portion provided parallel to the wafer-mounting surface and spaced from the circuit portion in a direction opposite to a direction toward the wafer-mounting surface, and 
 a connecting portion configured to electrically connect the circuit portion and the pull-out portion to each other; 
   a second circuit portion embedded in the ceramic base and provided parallel to the wafer-mounting surface;   a second electrode terminal portion connected to the second circuit portion;   an electrode terminal portion connected to the pull-out portion; and   a cylindrical support configured to support a lower surface of the ceramic base, wherein   a portion of the electrode terminal portion and a portion of the second electrode terminal portion are housed in the cylindrical support on a side of the lower surface.   
     
     
         2 . The wafer holder according to  claim 1 , wherein
 the conductive member constitutes an RF electrode or a resistance heating element.   
     
     
         3 . The wafer holder according to  claim 1 , comprising a plurality of the conductive members,
 each of the plurality of the conductive members constituting an RF electrode or a resistance heating element.   
     
     
         4 . The wafer holder according to  claim 1 , wherein
 the second circuit portion is an RF electrode or a resistance heating element or an electrostatic chuck electrode.   
     
     
         5 . The wafer holder according to  claim 1 , wherein
 the connecting portion is a ceramic member covered with a metal layer.   
     
     
         6 . The wafer holder according to  claim 1 , wherein
 the ceramic base has a disk shape, and the plurality of the conducting members are arranged at regular intervals in a circumferential direction of the disk shape.   
     
     
         7 . The wafer holder according to  claim 3 , wherein
 the pull-out portions of the plurality of the conductive members are provided within a plane parallel to the wafer-mounting surface in a thickness direction of the ceramic base.