Electroless copper plating solution

Abstract

An object is to provide an electroless copper plating solution with excellent solution stability and easy composition control while being used in a neutral range. To achieve the object, a reducing electroless copper plating solution used in a neutral range is employed that contains a copper salt serving as a copper ion supply source, a complexing agent for chelating copper ions, a reducing agent, a surfactant, an aromatic compound containing nitrogen, and contains a tellurium compound serving as a deposition stabilizer, and that has a solution pH of 6 to 9.

1 . A reducing electroless copper plating solution used in a neutral range,
 comprising a copper salt serving as a copper ion supply source, a complexing agent for chelating copper ions, a reducing agent, a surfactant, an aromatic compound containing nitrogen,   wherein the complexing agent for chelating copper ions is a phosphonic acid-based chelating agent,   wherein the reducing agent is amine borane or a derivative thereof, and   comprising a tellurium compound serving as a deposition stabilizer is used in a concentration range of 0.1 mg/L to 100 mg/L in terms of tellurium, and   having a solution pH of 6 to 9.   
     
     
         2 . The electroless copper plating solution according to  claim 1 , wherein the tellurium compound serving as a deposition stabilizer is at least one selected from the group consisting of telluric acid and a salt thereof, tellurous acid and a salt thereof, tellurium dioxide, tellurium trioxide, tellurium chloride, and dimethyl telluride. 
     
     
         3 . The electroless copper plating solution according to  claim 1 , wherein the phosphonic acid-based chelating agent is used in a concentration range of 0.1 to 10 times the number of moles of copper in the electroless copper plating solution. 
     
     
         4 . The electroless copper plating solution according to  claim 1 , wherein the reducing agent is at least one selected from the group consisting of dimethylamine borane, diethylamine borane, tert-butylamine borane, triethylamine borane, trimethylamine borane. 
     
     
         5 . The electroless copper plating solution according to  claim 1 , wherein the surfactant is an anionic surfactant used in a concentration range of 0.01 mg/L to 1500 mg/L. 
     
     
         6 . The electroless copper plating solution according to  claim 1 , wherein the aromatic compound containing nitrogen is used in a concentration range of 0.01 mg/L to 1000 mg/L.