Latent reactive adhesive film
Abstract
The invention relates to an adhesive film which comprises a layer of an adhesive that comprises one or more polymers and at least one peroxide, characterized in that the adhesive comprises at last 50% by weight of thermoplastic polymers that do not have C═C multiple bonds, in that at least one peroxide has the general structural formula R—O—O—R′, wherein R and R′ each represent organyl groups or together represent a cyclic organyl group, and in that the peroxide in solution has a 1-minute half-life temperature of less than 200° C. In a preferred embodiment, the thermoplastic polymer is a polyurethane and the peroxide is a dicumyl peroxide.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A latently reactive adhesive film, comprising:
a layer of an adhesive, the adhesive comprising one or more polymers and at least one peroxide, wherein the one or more polymers comprises at least 50% by weight of thermoplastic polymers having no C═C multiple bonds, wherein the at least one peroxide has the general structural formula R—O—O—R′ where R and R′ each represent organyl groups or collectively represent a cyclic organyl group, further wherein the at least one peroxide in solution has a 1 minute half-life temperature of less than 200° C., and further wherein the at least one peroxide exhibits a half-life at 80° C. of at least 13.5 hours.
2 . The latently reactive adhesive film of claim 1 , wherein
the at least one peroxide is dicumyl peroxide.
3 . The latently reactive adhesive film of claim 1 , wherein
an amount of the at least one peroxide in the adhesive is chosen within the range from 0.1% to 10% by weight.
4 . The latently reactive adhesive film of claim 1 , wherein
at least one of the thermoplastic polymers is a polyurethane.
5 . The latently reactive adhesive film of claim 1 , wherein
at least one of the thermoplastic polymers is semicrystalline.
6 . The latently reactive adhesive film of claim 1 , wherein
the thermoplastic polymers have a maximum softening temperature of not more than 25° C.
7 . The latently reactive adhesive film of claim 1 , wherein
the one or more polymers have a maximum glass transition temperature of not more than −25° C., as determined by dynamic differential calorimetry (DSC).
8 . The latently reactive adhesive film of claim 1 , wherein
the latently reactive adhesive film is curable by thermal activation.
9 . The latently reactive adhesive film of claim 1 , wherein
at least one of the thermoplastic polymers is a thermoplastic elastomer.
10 . The latently reactive adhesive film of claim 1 further comprising:
at least one adhesion promoter.
11 . The latently reactive adhesive film of claim 10 ,
wherein the at least one adhesion promoter is at least one silane functionalized by one or more alkoxy groups.
12 . The latently reactive adhesive film of claim 11 , wherein
the one or more alkoxy groups comprises methoxy and/or ethoxy groups.
13 . The latently reactive adhesive film of claim 1 , wherein
an adhesive strength of the latently reactive adhesive film, as disposed on a substrate surface, after curing, and after storage at 23° C., 50% relative humidity (RH) for eighteen weeks, is at least 90% of an adhesive strength of the latently reactive adhesive film, as disposed on a substrate surface, after curing, and after storage for not more than one day at 23° C., 50% RH.
14 . The latently reactive adhesive film of claim 1 , wherein
an adhesive strength of the latently reactive adhesive film, as disposed on a substrate surface, after curing, and after storage at 40° C. for eighteen weeks in a drying cabinet under standard climatic conditions (23° C./50% relative humidity (RH)), is at least 90% of an adhesive strength of the latently reactive adhesive film, as disposed on a substrate surface, after curing, and after storage for not more than one day at 23° C., 50% RH.
15 . The latently reactive adhesive film of claim 1 , wherein
a force that acts perpendicularly and completely parts an adhesive bond established with the latently reactive adhesive film, as having a thickness of 100 pm and stored beforehand at 23° C., 50% relative humidity (RH) for six weeks, is at least 90% of a force that acts perpendicularly and completely parts an adhesive bond established with the latently reactive adhesive film, as also having a thickness of 100 pm and stored for not longer than one day beforehand, each of the adhesive bonds has been established by a pressurized bonding of a polycarbonate disk with a frame made of anodized aluminum by means of a layer of the latently reactive adhesive film, the pressurized bonding is effected at a temperature of 190° C. and a pressure of 10 bar for 10 s with an effective bond area of 282 mm 2 , and the force is measured at 23° C. and 50% RH.
16 . The latently reactive adhesive film of claim 1 , wherein
a force that acts perpendicularly and completely parts an adhesive bond established with the latently reactive adhesive film, as having a thickness of 100 pm and stored beforehand at 23° C., 50% relative humidity (RH) for eighteen weeks, then stored at 85° C. and 85% RH for 72 h and reconditioned at 23° C., 50% RH for 24 h, is at least 50% of a force that acts perpendicularly and completely parts an adhesive bond established with the latently reactive adhesive film, as also having a thickness of 100 pm and stored for not longer than one day beforehand, each of the adhesive bonds has been established by a pressurized bonding of a polycarbonate disk with a frame made of anodized aluminum by means of a layer of the adhesive film, the pressurized bonding is effected at a temperature of 190° C. and a pressure of 10 bar for 10 s with an effective bond area of 282 mm 2 , and the force is measured at 23° C. and 50% RH.
17 . The latently reactive adhesive film of claim 1 , wherein
a force that acts perpendicularly and completely parts an adhesive bond established with the latently reactive adhesive film, as having a thickness of 100 pm and stored beforehand at 40° C. in a drying cabinet under standard climatic conditions (23° C./50% RH) for eighteen weeks and then stored at 85° C. and 85% RH for 72 h and reconditioned at 23° C., 50% RH for 24 h, is at least 50% of a force that acts perpendicularly and completely parts an adhesive bond established with the latently reactive adhesive film, as also having a thickness of 100 pm and stored for not longer than one day beforehand, each of the adhesive bonds has been established by a pressurized bonding of a polycarbonate disk with a frame made of anodized aluminum by means of a layer of the latently reactive adhesive film, the pressurized bonding is effected at a temperature of 190° C. and a pressure of 10 bar for 10 s with an effective bond area of 282 mm 2 , and the force is measured at 23° C. and 50% RH.
18 . The latently reactive adhesive film of claim 1 , wherein
the at least one peroxide exhibits a half-life at 80° C. of at least 22.5 hours.
19 . The latently reactive adhesive film of claim 1 , wherein
the at least one peroxide exhibits a half-life at 80° C. of at least 69 hours.
20 . The latently reactive adhesive film of claim 1 , wherein
the at least one peroxide is a ketone peroxide or a cyclic peroxide.
21 . A one-component latently reactive adhesive film comprising:
(i) an adhesive composition comprising:
a polymer component comprising at least 50% by weight of at least one thermoplastic polymer lacking C═C bonds and lacking C≡C bonds; and
at least one peroxide having a general structure R—O—O—R′, where R and R′ are organyl groups; and
(ii) a reinforcing layer, carrier layer, or liner disposed on one side of the adhesive composition; wherein, the adhesive composition is storage stable and does not cure or cures over a period of months under standard climatic conditions of 23° C. and 50% relative humidity; wherein, the adhesive composition is thermally reactive, and upon thermal activation, the adhesive composition melts and a cross-linking reaction involving the at least one thermoplastic polymer occurs; and wherein, the one side of the adhesive composition is configured to be adhered to a first substrate; and wherein, the other side of the adhesive composition is configured to be adhered to a second substrate, such that the first substrate and the second substrate are attached to each other and neither the first substrate nor the second substrate are adhesives.
22 . The one-component latently reactive adhesive film of claim 21 further comprising a second reinforcing layer, carrier layer, or liner disposed on the other side of the adhesive composition.
23 . The one-component latently reactive adhesive film of claim 21 , wherein
the adhesive composition further comprises a silane adhesion promotor and a tackifier resin.
24 . The latently reactive adhesive film of claim 21 , wherein
the at least one peroxide comprises a ketone peroxide or a cyclic peroxide.
25 . A latently reactive adhesive film comprising:
an adhesive composition comprising:
a polymer component comprising at least 50% by weight of at least one thermoplastic polymer lacking C═C bonds and lacking C≡C bonds; and
at least one peroxide comprising a ketone peroxide or a cyclic peroxide;
wherein, the adhesive composition is storage stable and does not cure or cures over a period of months under standard climatic conditions of 23° C. and 50% relative humidity; and wherein, the adhesive composition is thermally reactive, and upon thermal activation, the adhesive composition melts and a cross-linking reaction involving the at least one thermoplastic polymer occurs.
26 . The latently reactive adhesive film of claim 25 further comprising:
a reinforcing layer, carrier layer, or liner disposed on one side of the adhesive composition;
wherein, the one side of the adhesive composition is configured to be adhered to a first substrate; and
wherein, the other side of the adhesive composition is configured to be adhered to a second substrate, such that the first substrate and the second substrate are attached to each other and neither the first substrate nor the second substrate are adhesives.Join the waitlist — get patent alerts
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