Electronic device

Abstract

An electronic device includes a first substrate, a second substrate, an electronic component, an integrated circuit and a first connection line. The second substrate is opposite to the first substrate. The electronic component is disposed between the first substrate and the second substrate. The integrated circuit is for driving the electronic component. The first connection line is disposed on a side surface of the second substrate and disposed on a side surface of the first substrate. The electronic component is electrically connected with the integrated circuit through the first connection line.

What is claimed is: 
     
         1 . An electronic device, comprising:
 a first substrate;   a second substrate opposite to the first substrate;   an electronic component disposed between the first substrate and the second substrate;   an integrated circuit for driving the electronic component; and   a first connection line disposed on a side surface of the second substrate and disposed on a side surface of the first substrate,   wherein the electronic component is electrically connected with the integrated circuit through the first connection line.   
     
     
         2 . The electronic device according to  claim 1 , further comprising a first conductive line disposed on an outer surface of the first substrate. 
     
     
         3 . The electronic device according to  claim 2 , wherein a portion of the first connection line is overlapped with the first conductive line. 
     
     
         4 . The electronic device according to  claim 1 , further comprising a backlight module disposed on a side of the first substrate opposite to the second substrate. 
     
     
         5 . The electronic device according to  claim 4 , wherein the integrated circuit is disposed on a surface of the backlight module away from the first substrate. 
     
     
         6 . The electronic device according to  claim 1 , wherein the first connection line is directly in contact with the side surface of the second substrate. 
     
     
         7 . The electronic device according to  claim 1 , wherein a portion of the first connection line overlaps an inner surface of the second substrate in a normal direction of the first substrate. 
     
     
         8 . The electronic device according to  claim 7 , wherein the first connection line is directly in contact with the side surface of the second substrate and the side surface of the first substrate. 
     
     
         9 . The electronic device according to  claim 1 , wherein the first substrate is disposed between the second substrate and the integrated circuit. 
     
     
         10 . The electronic device according to  claim 1 , wherein the first connection line is made of conductive material.