Apparatus and system of a printed circuit board (pcb) including a radio frequency (rf) transition

Abstract

For example, an apparatus may include a Printed Circuit Board (PCB) including a Ball Grid Array (BGA) on a first side of the PCB, the BGA configured to connect a Surface Mounted Device (SMD) to the PCB; an antenna disposed on a second side of the PCB opposite to the first side, the antenna to communicate a Radio Frequency (RF) signal of the SMD; and an RF transition to transit the RF signal between the BGA and the antenna, the RF transition including a plurality of signal buried-vias; a first plurality of microvias configured to transit the RF signal between the plurality of signal buried-vias and a ball of the BGA, the first plurality of microvias are rotationally misaligned with respect to the plurality of signal buried-vias; and a second plurality of microvias configured to transit the RF signal between the plurality of signal buried-vias and the antenna.

1 . (canceled) 
     
     
         2 . An apparatus comprising:
 a multi-layer Printed Circuit Board (PCB);   at least one antenna on a first side of the multi-layer PCB; and   a ball array on a second side of the multi-layer PCB, the second side opposite to the first side,   wherein the multi-layer PCB comprises a multi-layer Radio Frequency (RF) transition configured to transit RF signals between the antenna and the ball array, the multi-layer RF transition comprising:
 a signal via layer comprising a plurality of signal vias, wherein first ends of the plurality of signal vias are coupled to the antenna; 
 a microvia layer comprising a plurality of microvias, wherein first ends of the plurality of microvias are coupled to the ball array, wherein the plurality of microvias are misaligned with the plurality of signal vias; and 
 a connection layer between the signal via layer and the microvia layer, wherein the connection layer is configured to connect between second ends of the plurality of signal vias and second ends of the plurality of microvias. 
   
     
     
         3 . The apparatus of  claim 2 , wherein the at least one antenna comprises a plurality of antennas on the first side of the multi-layer PCB, wherein the multi-layer RF transition is configured to transit the RF signals between the ball array and the plurality of antennas. 
     
     
         4 . The apparatus of  claim 3 , wherein the signal via layer comprises a first plurality of signal vias and a second plurality of signal vias, wherein first ends of the first plurality of signal vias are coupled to a first antenna, wherein first ends of the second plurality of signal vias are coupled to a second antenna. 
     
     
         5 . The apparatus of  claim 4 , wherein the microvia layer comprises a first plurality of microvias and a second plurality of microvias, wherein first ends of the first and second pluralities of microvias are coupled to the ball array, wherein the connection layer is configured to connect between second ends of the first plurality of microvias and second ends of the first plurality of signal vias, wherein the connection layer is configured to connect between second ends of the second plurality of microvias and second ends of the second plurality of signal vias. 
     
     
         6 . The apparatus of  claim 2 , wherein the multi-layer RF transition comprises a plurality of grounded peripheral vias surrounding the plurality of signal vias. 
     
     
         7 . The apparatus of  claim 2 , wherein the plurality of signal vias comprises at least three signal vias, and the plurality of microvias comprises at least three microvias. 
     
     
         8 . The apparatus of  claim 2 , wherein the plurality of microvias are rotationally misaligned with respect to the plurality of signal vias. 
     
     
         9 . The apparatus of  claim 2 , wherein a count of microvias in the plurality of microvias is equal to a count of signal vias in the plurality of signal vias. 
     
     
         10 . The apparatus of  claim 2 , wherein the antenna comprises a patch antenna. 
     
     
         11 . The apparatus of  claim 2 , wherein the RF signals comprise millimeter wave (mmWave) signals in a frequency band above 30 Gigahertz (GHz). 
     
     
         12 . The apparatus of  claim 2 , wherein the signal via layer comprises a signal buried-via layer, wherein the plurality of signal vias comprises a plurality of signal buried-vias. 
     
     
         13 . The apparatus of  claim 2  comprising an RF Integrated Circuit (IC) to process the RF signals, wherein the RF IC is coupled to the ball array. 
     
     
         14 . An apparatus comprising:
 a multi-layer Printed Circuit Board (PCB) package comprising:
 at least one antenna on a first side of the multi-layer PCB package; 
 a Radio Frequency (RF) Integrated Circuit (IC) coupled by a ball array to a second side of the multi-layer PCB package, the RF IC configured to process RF signals to be communicated via the antenna; and 
 a multi-layer RF transition configured to transit the RF signals between the antenna and the ball array, wherein the multi-layer RF transition comprises:
 a signal via layer comprising a plurality of signal vias, wherein first ends of the plurality of signal vias are coupled to the antenna; 
 a microvia layer comprising a plurality of microvias, wherein first ends of the plurality of microvias are coupled to the ball array, wherein the plurality of microvias are misaligned with the plurality of signal vias; and 
 a connection layer between the signal via layer and the microvia layer, wherein the connection layer is configured to connect between second ends of the plurality of signal vias and second ends of the plurality of microvias. 
 
   
     
     
         15 . The apparatus of  claim 14 , wherein the at least one antenna comprises a plurality of antennas on the first side of the multi-layer PCB package, wherein the multi-layer RF transition is configured to transit the RF signals between the ball array and the plurality of antennas. 
     
     
         16 . The apparatus of  claim 15 , wherein the signal via layer comprises a first plurality of signal vias and a second plurality of signal vias, wherein first ends of the first plurality of signal vias are coupled to a first antenna, wherein first ends of the second plurality of signal vias are coupled to a second antenna. 
     
     
         17 . The apparatus of  claim 16 , wherein the microvia layer comprises a first plurality of microvias and a second plurality of microvias, wherein first ends of the first and second pluralities of microvias are coupled to the ball array, wherein the connection layer is configured to connect between second ends of the first plurality of microvias and second ends of the first plurality of signal vias, wherein the connection layer is configured to connect between second ends of the second plurality of microvias and second ends of the second plurality of signal vias. 
     
     
         18 . The apparatus of  claim 14 , wherein the multi-layer RF transition comprises a plurality of grounded peripheral vias surrounding the plurality of signal vias. 
     
     
         19 . The apparatus of  claim 14 , wherein the plurality of microvias are rotationally misaligned with respect to the plurality of signal vias. 
     
     
         20 . The apparatus of  claim 14 , wherein the signal via layer comprises a signal buried-via layer, wherein the plurality of signal vias comprises a plurality of signal buried-vias. 
     
     
         21 . A mobile device comprising:
 a display;   a processor;   a memory; and   a multi-layer Printed Circuit Board (PCB) package comprising:
 at least one antenna on a first side of the multi-layer PCB package; 
 a Radio Frequency (RF) Integrated Circuit (IC) coupled by a ball array to a second side of the multi-layer PCB package, the RF IC configured to process RF signals to be communicated via the antenna; and 
 a multi-layer RF transition configured to transit the RF signals between the antenna and the ball array, wherein the multi-layer RF transition comprises:
 a signal via layer comprising a plurality of signal vias, wherein first ends of the plurality of signal vias are coupled to the antenna; 
 a microvia layer comprising a plurality of microvias, wherein first ends of the plurality of microvias are coupled to the ball array, wherein the plurality of microvias are misaligned with the plurality of signal vias; and 
 a connection layer between the signal via layer and the microvia layer, wherein the connection layer is configured to connect between second ends of the plurality of signal vias and second ends of the plurality of microvias. 
 
   
     
     
         22 . The mobile device of  claim 21 , wherein the at least one antenna comprises a plurality of antennas on the first side of the multi-layer PCB package, wherein the multi-layer RF transition is configured to transit the RF signals between the ball array and the plurality of antennas. 
     
     
         23 . The mobile device of  claim 21 , wherein the plurality of microvias are rotationally misaligned with respect to the plurality of signal vias.