Laminate, method for manufacturing laminate, and method for manufacturing flexible electronic device

Abstract

Provided is a laminate that is useful as a temporary support for producing a large-area, high-definition, flexible electronic device, the laminate having stably low adhesive strength between a heat-resistant polymer film and an inorganic substrate even in the case of a large surface area, and having few blister defects. This laminate has an inorganic substrate, a silane coupling agent layer that includes amino groups, and a heat-resistant polymer film in the stated order, the laminate being characterized in that the elemental nitrogen component ratio in an inorganic-substrate-side peel surface after the heat-resistant polymer film has been peeled from the inorganic substrate at 90° is greater than 3.5 at % and no greater than 11 at %.

1 . A laminate comprising an inorganic substrate, a layer of a silane coupling agent containing an amino group, and a heat resistant polymer film in this order, wherein an elemental nitrogen component ratio on a peeled surface on an inorganic substrate side is more than 3.5 at % and 11 at % or less after the heat resistant polymer film has been peeled off from the inorganic substrate at 90°. 
     
     
         2 . The laminate according to  claim 1 , wherein an adhesive strength by a 90° peeling method when the heat resistant polymer film is peeled off from the laminate is 0.06 N/cm or more and 0.25 N/cm or less. 
     
     
         3 . The laminate according to  claim 1 , wherein a surface roughness Ra of the inorganic substrate is 1 nm or more and 1000 nm or less. 
     
     
         4 . The laminate according to  claim 1 , wherein the heat resistant polymer film is a polyimide film. 
     
     
         5 . The laminate according to  claim 1 , wherein a blister defect density is 12 spots or less per 1 square meter. 
     
     
         6 . The laminate according to  claim 1 , wherein the laminate is rectangular, has an area of 0.65 square meter or more, and has a rectangular side of at least 700 mm or more. 
     
     
         7 . A method for manufacturing a laminate including an inorganic substrate, a layer of a silane coupling agent containing an amino group, and a heat resistant polymer film in this order, the method comprising at least:
 (1) a step of coating at least one surface of an inorganic substrate with a silane coupling agent containing an amino group;   (2) a step of supplying an aqueous medium to a silane coupling agent-coated surface of the inorganic substrate and/or a bonding surface side of a heat resistant polymer film;   (3) a step of stacking the silane coupling agent-coated surface of the inorganic substrate and the heat resistant polymer film; and   (4) a step of pressurizing the inorganic substrate and the heat resistant polymer film while extruding the aqueous medium from between the silane coupling agent-coated surface of the inorganic substrate and the bonding surface of the heat resistant polymer film.   
     
     
         8 . A method for manufacturing a laminate including an inorganic substrate, a layer of a silane coupling agent containing an amino group, and a heat resistant polymer film in this order, the method comprising at least:
 (1) a step of coating at least one surface of a heat resistant polymer film with a silane coupling agent containing an amino group;   (2) a step of supplying an aqueous medium to a bonding surface side of an inorganic substrate and/or a silane coupling agent-coated surface of the heat resistant polymer film;   (3) a step of stacking the inorganic substrate and the silane coupling agent-coated surface of the heat resistant polymer film; and   (4) a step of pressurizing the inorganic substrate and the heat resistant polymer film while extruding the aqueous medium from between the bonding surface of the inorganic substrate and the silane coupling agent-coated surface of the heat resistant polymer film.   
     
     
         9 . A method for manufacturing a flexible electronic device, the method comprising a step of forming a functional element on a surface on an opposite side to a bonding surface of a heat resistant polymer film with an inorganic substrate of a laminate obtained by the manufacturing method according to  claim 7 .