Electronic device

Abstract

An electronic device includes a substrate, a redistribution layer disposed on the substrate, and an electronic component disposed on the redistribution layer and electrically connected to the redistribution layer.

What is claimed is: 
     
         1 . An electronic device, comprising:
 a substrate;   a redistribution layer disposed on the substrate; and   an electronic component disposed on the redistribution layer and electrically connected to the redistribution layer.   
     
     
         2 . The electronic device of  claim 1 , further comprising:
 an electrode comprising a first sub-electrode and a second sub-electrode,   
       wherein the redistribution layer is located between the electrode and the substrate, and there is a gap existing between the first sub-electrode and the second sub-electrode. 
     
     
         3 . The electronic device of  claim 2 , wherein the electronic component is bonded to the substrate to control the electrode. 
     
     
         4 . The electronic device of  claim 3 , further comprising:
 a first bonding pad,   
       wherein the electronic component has a second bonding pad and is electrically connected to the electrode via the first bonding pad and the second bonding pad. 
     
     
         5 . The electronic device of  claim 2 , wherein the electrode comprises a composite layer. 
     
     
         6 . The electronic device of  claim 1 , wherein the redistribution layer comprises at least one conductive layer and at least one dielectric layer. 
     
     
         7 . The electronic device of  claim 1 , wherein the electronic device is applied to a high-frequency device. 
     
     
         8 . The electronic device of  claim 7 , wherein the high-frequency device is applied to an antenna. 
     
     
         9 . An electronic device, comprising:
 a substrate;   a first redistribution layer disposed on the substrate;   a second redistribution layer disposed on the first redistribution; and   a dielectric layer disposed between the first redistribution layer and the second redistribution layer,   
       wherein the dielectric layer has a dissipation factor value less than or equal to 0.03. 
     
     
         10 . The electronic device of  claim 9 , wherein one of the first redistribution layer and the second redistribution layer comprises at least one conductive layer and at least one dielectric layer. 
     
     
         11 . The electronic device of  claim 9 , wherein the electronic device is applied to a high-frequency device. 
     
     
         12 . The electronic device of  claim 11 , wherein the high-frequency device is applied to an antenna. 
     
     
         13 . The electronic device of  claim 9 , wherein the dissipation factor value is less than or equal to 0.01.