Organic light-emitting display apparatus and method of manufacturing the same

Abstract

An organic light-emitting display apparatus includes: a substrate; first and second pixel electrodes on the substrate and spaced from each other; an insulating layer between the first and second pixel electrodes, the insulating layer covering ends of the first and second pixel electrodes, and having a step height difference; an auxiliary electrode on the insulating layer; first and second intermediate layers on the first and second pixel electrodes, the first and second intermediate layers being spaced from each other, and including first and second light-emitting layers, respectively; first and second opposite electrodes on the first and second intermediate layers, the first and second opposite electrodes being spaced from each other, and in contact with the auxiliary electrode; and first and second passivation layers on the first and second opposite electrodes, the first and second passivation layers being spaced from each other, and covering the first and second opposite electrodes, respectively.

What is claimed is: 
     
         1 . A method of manufacturing an organic light-emitting display apparatus, the method comprising:
 forming a first pixel electrode and a second pixel electrode on a substrate, the first and second pixel electrodes being spaced from each other;   forming an insulating layer to cover ends of the first and second pixel electrodes, the insulating layer having a step height difference;   forming an auxiliary electrode on the insulating layer;   sequentially forming a first lift-off layer and a first photoresist on the first and second pixel electrodes, the insulating layer, and the auxiliary electrode;   forming a first opening that exposes an upper surface of the first pixel electrode, an upper surface of the insulating layer, and an upper surface of the auxiliary electrode, by patterning the first lift-off layer and the first photoresist;   sequentially forming a first intermediate layer and a first opposite electrode on both the first opening and the first photoresist, the first intermediate layer comprising a first light-emitting layer;   forming a first passivation layer to cover an upper surface of the first opposite electrode and ends of the first opposite electrode; and   removing each of the first lift-off layer and the first photoresist.   
     
     
         2 . The method of  claim 1 , wherein the first intermediate layer is formed by using a first deposition process, the first opposite electrode is formed by using a second deposition process, and the first passivation layer is formed by using a third deposition process that provides a step coverage greater than step coverages of the first intermediate layer and the first opposite electrode. 
     
     
         3 . The method of  claim 2 , wherein a physical vapor deposition process is used in the first deposition process and the second deposition process. 
     
     
         4 . The method of  claim 2 , wherein a chemical vapor deposition process or an atomic layer deposition process is used in the third deposition process. 
     
     
         5 . The method of  claim 2 , wherein a portion of the first passivation layer that is on the auxiliary electrode is removed by performing dry etching after the third deposition process is performed. 
     
     
         6 . The method of  claim 1 , wherein at the first opening, an end of the first photoresist extends further towards a central area of the first opening than an end of the first lift-off layer, and during a process of forming the first passivation layer, an area of the end of the first photoresist sags toward the substrate to form an overhang structure. 
     
     
         7 . The method of  claim 1 , further comprising:
 forming a first connection layer between the first opposite electrode and the first passivation layer.   
     
     
         8 . The method of  claim 1 , further comprising:
 sequentially forming a second lift-off layer and a second photoresist on the second pixel electrode, the insulating layer, and the auxiliary electrode, after removing each of the first lift-off layer and the first photoresist;   forming a second opening that exposes an upper surface of the second pixel electrode, an upper surface of the insulating layer, and an upper surface of the auxiliary electrode, by patterning the second lift-off layer and the second photoresist;   sequentially forming a second intermediate layer and a second opposite electrode on both the second opening and the second photoresist, the second intermediate layer comprising a second light-emitting layer;   forming a second passivation layer to cover an upper surface of the second opposite electrode and ends of the second opposite electrode; and   removing each of the second lift-off layer and the second photoresist.   
     
     
         9 . The method of  claim 8 , wherein a color of light that is emitted from the first light-emitting layer is different from a color of light that is emitted from the second light-emitting layer. 
     
     
         10 . The method of  claim 8 , further comprising:
 forming an encapsulation member on the first passivation layer and the second passivation layer, the encapsulation member comprising at least one organic layer and at least one inorganic layer.