Electronic component, manufacturing method thereof, and electronic apparatus

Abstract

A manufacturing method of an electronic component includes preparing a first structure in which a first electrode is arranged on a first main surface of a first substrate, preparing a second structure in which a second electrode is arranged on a first main surface of a second substrate, and curing a bonding member while making the first main surface of the first substrate and the first main surface of the second substrate face each other via the bonding member and applying a force to the first structure and the second structure so as to pressurize the bonding member. At least one of the first electrode and the second electrode includes a window portion. In the curing, the bonding member is cured by irradiating the bonding member with light through the window portion.

What is claimed is: 
     
         1 . A manufacturing method of an electronic component, the method comprising:
 preparing a first structure in which a first electrode is arranged on a first main surface of a first substrate;   preparing a second structure in which a second electrode is arranged on a first main surface of a second substrate; and   curing a bonding member while making the first main surface of the first substrate and the first main surface of the second substrate face each other via the bonding member and applying a force to the first structure and the second structure so as to pressurize the bonding member,   wherein at least one of the first electrode and the second electrode includes a window portion, and in the curing, the bonding member is cured by irradiating the bonding member with light through the window portion.   
     
     
         2 . The method according to  claim 1 , wherein
 the window portion is an opening portion.   
     
     
         3 . The method according to  claim 1 , wherein
 an absorption rate of the light by the bonding member is higher than an absorption rate of the light by one of the first electrode and the second electrode which includes the window portion.   
     
     
         4 . The method according to  claim 1 , wherein
 the bonding member includes a first portion arranged in a first region not sandwiched between the first electrode and the second electrode, and a second portion arranged in a second region sandwiched between the first electrode and the second electrode, and   the curing includes   curing the first portion after a fluidity of the first portion is increased by selectively irradiating the first portion with the light, and   curing the second portion after a fluidity of the second portion is increased by selectively irradiating, with the light through the window portion, a portion of the second portion where the window portion exists, after the curing of the first portion.   
     
     
         5 . The method according to  claim 1 , wherein
 the first structure includes a plurality of the first electrodes, and the plurality of the first electrodes are arranged along a predetermined direction,   the second structure includes a plurality of the second electrodes, and the plurality of the second electrodes are arranged along the predetermined direction, and   the curing of the bonding member includes   irradiating, with the light, a central portion of the bonding member in the predetermined direction, and   irradiating, with the light, a peripheral portion of the bonding member in the predetermined direction after the irradiating of the central portion.   
     
     
         6 . An electronic component comprising:
 a first structure in which a first electrode is arranged on a first main surface of a first substrate,   a second structure in which a second electrode is arranged on a first main surface of a second substrate, and   a bonding member arranged between the first main surface of the first substrate and the first main surface of the second substrate so as to electrically bond the first electrode and the second electrode,   wherein at least one of the first electrode and the second electrode includes a window portion that transmits light.   
     
     
         7 . The component according to  claim 6 , wherein
 one window portion is provided in one electrode which is the at least one of the first electrode and the second electrode.   
     
     
         8 . The component according to  claim 6 , wherein
 a plurality of window portions including the window portion are provided in one electrode which is the at least one of the first electrode and the second electrode.   
     
     
         9 . The component according to  claim 8 , wherein
 the plurality of window portions are arranged along a longitudinal direction of the one electrode, and   a distance from an edge of the one electrode in a lateral direction to each of the plurality of window portions is larger than an interval between window portions adjacent to each other out of the plurality of window portions.   
     
     
         10 . The component according to  claim 8 , wherein
 a center line of the one electrode along a longitudinal direction is arranged so as to pass through the plurality of window portions.   
     
     
         11 . The component according to  claim 8 , wherein
 the plurality of window portions are arranged in a grid.   
     
     
         12 . An electronic apparatus that comprises an electronic component defined in  claim 6 , wherein
 the electronic component is formed as a display panel.