Multilayer electronic component having moisture-proof layer on body thereof

Abstract

A multilayer electronic component includes a body including dielectric layers and first and second internal electrodes alternately laminated with respective dielectric layers interposed therebetween, and first and second surfaces opposing each other in a direction by which the internal electrodes are laminated, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a moisture-proof layer disposed on at least one surface of any one of the first, second, fifth, or sixth surface and containing a rare-earth oxide; a first external electrode disposed on the third surface and connected to the first internal electrodes; and a second external electrode disposed on the fourth surface and connected to the second internal electrodes.

What is claimed is: 
     
         1 . A multilayer electronic component, comprising:
 a body comprising a capacitance-generating portion including dielectric layers and first and second internal electrodes alternately laminated in one direction with respective dielectric layers interposed therebetween, and cover portions respectively disposed on an upper portion and a lower portion of the capacitance-generating portion, the body having first and second surfaces opposing each other in the one direction, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other;   an oxide layer disposed on the first, second, fifth and sixth surface, being spaced apart from the first and second internal electrodes, and comprising a rare-earth oxide;   a first external electrode disposed on the third surface and connected to the first internal electrodes; and   a second external electrode disposed on the fourth surface and connected to the second internal electrodes,   wherein a thickness of the oxide layer is less than that of the cover portions.   
     
     
         2 . The multilayer electronic component of  claim 1 , wherein the rare-earth oxide is at least one selected from dysprosium oxide (Dy 2 O 3 ), cerium oxide (CeO 2 ), praseodymium oxide (Pr 6 O 11 ), neodymium oxide (Nd 2 O 3 ), samarium oxide (Sm 2 O 3 ), europium oxide (Eu 2 O 3 ), gadolinium oxide (Gd 2 O 3 ), terbium oxide (Tb 4 O 7 ), holmium oxide (Ho 2 O 3 ), erbium oxide (Er 2 O 3 ), thulium oxide (Tm 2 O 3 ), ytterbium oxide (Yb 2 O 3 ), or lutetium oxide (Lu 2 O 3 ). 
     
     
         3 . The multilayer electronic component of  claim 1 , wherein the rare-earth oxide is Dy 2 O 3 . 
     
     
         4 . The multilayer electronic component of  claim 1 , wherein a thickness of the oxide layer is at least 100 nm. 
     
     
         5 . The multilayer electronic component of  claim 4 , wherein the thickness of the oxide layer is 100 μm or less. 
     
     
         6 . The multilayer electronic component of  claim 1 , wherein the oxide layer further comprises a same material as the dielectric layers. 
     
     
         7 . The multilayer electronic component of  claim 1 , wherein the first internal electrodes are spaced out from the fourth surface of the body and is in contact with the third, fifth, and sixth surfaces, and
 the second internal electrodes are spaced out from the third surface and is in contact with the fourth, fifth, and sixth surfaces.   
     
     
         8 . The multilayer electronic component of  claim 1 , wherein the first internal electrodes are spaced out from the fourth, fifth, and sixth surfaces of the body and is exposed through the third surface, and
 the second internal electrodes are spaced out from the third, fifth, and sixth surfaces and is exposed through the fourth surface.   
     
     
         9 . The multilayer electronic component of  claim 1 , wherein the first external electrode comprises a first electrode layer in contact with the first internal electrodes, and a first conductive resin layer disposed on the first electrode layer, and
 the second external electrode comprises a second electrode layer in contact with the second internal electrodes, and a second conductive resin layer disposed on the second electrode layer.   
     
     
         10 . The multilayer electronic component of  claim 9 , wherein the first and second electrode layers comprise a conductive metal and glass. 
     
     
         11 . The multilayer electronic component of  claim 9 , wherein the first and second conductive resin layers comprise a conductive metal and resin. 
     
     
         12 . The multilayer electronic component of  claim 9 , further comprising a conductive layer disposed on each of the first and second conductive resin layers. 
     
     
         13 . The multilayer electronic component of  claim 1 , wherein the oxide layer is hydrophobic. 
     
     
         14 . The multilayer electronic component of  claim 1 , wherein among the dielectric layers and the oxide layer, the rare-earth oxide is contained only in the oxide layer. 
     
     
         15 . The multilayer electronic component of  claim 1 , wherein a weight percentage of the rare-earth oxide in the dielectric layers with respect to the total weight of the dielectric layers is less than a weight percentage of the rare-earth oxide in the oxide layer with respect to the total weight of the oxide layer. 
     
     
         16 . The multilayer electronic component of  claim 1 , wherein an average thickness of the dielectric layers is 0.4 μm or less. 
     
     
         17 . The multilayer electronic component of  claim 1 , wherein an average thickness of the first and second internal electrodes is 0.4 μm or less. 
     
     
         18 . The multilayer electronic component of  claim 1 , wherein an average thickness of the dielectric layers is 0.4 μm or less, and
 an average thickness of the first and second internal electrodes is 0.4 μm or less. 
 
     
     
         19 . A multilayer electronic component, comprising:
 a body comprising a capacitance-generating portion including dielectric layers and first and second internal electrodes alternately laminated in one direction with respective dielectric layers interposed therebetween, and cover portions respectively disposed on an upper portion and a lower portion of the capacitance-generating portion, the body having first and second surfaces opposing each other in the one direction, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other;   an oxide layer disposed on at least one surface of any one of the first, second, fifth or sixth surface, being spaced apart from the first and second internal electrodes, and comprising a rare-earth oxide;   a first external electrode disposed on the third surface and connected to the first internal electrodes; and   a second external electrode disposed on the fourth surface and connected to the second internal electrodes,   wherein a thickness of the oxide layer is less than that of the cover portions,   wherein among the dielectric layers and the oxide layer, the rare-earth oxide is contained only in the oxide layer.   
     
     
         20 . The multilayer electronic component of  claim 19 , wherein the rare-earth oxide is at least one selected from dysprosium oxide (Dy 2 O 3 ), cerium oxide (CeO 2 ), praseodymium oxide (Pr 6 O 11 ), neodymium oxide (Nd 2 O 3 ), samarium oxide (Sm 2 O 3 ), europium oxide (Eu 2 O 3 ), gadolinium oxide (Gd 2 O 3 ), terbium oxide (Tb 4 O 7 ), holmium oxide (Ho 2 O 3 ), erbium oxide (Er 2 O 3 ), thulium oxide (Tm 2 O 3 ), ytterbium oxide (Yb 2 O 3 ), or lutetium oxide (Lu 2 O 3 ). 
     
     
         21 . The multilayer electronic component of  claim 19 , wherein the rare-earth oxide is Dy 2 O 3 . 
     
     
         22 . The multilayer electronic component of  claim 19 , wherein a thickness of the oxide layer is at least 100 nm. 
     
     
         23 . The multilayer electronic component of  claim 22 , wherein the thickness of the oxide layer is 100 μm or less. 
     
     
         24 . The multilayer electronic component of  claim 19 , wherein the oxide layer further comprises a same material as the dielectric layers. 
     
     
         25 . The multilayer electronic component of  claim 19 , wherein the first internal electrodes are spaced out from the fourth surface of the body and is in contact with the third, fifth, and sixth surfaces, and
 the second internal electrodes are spaced out from the third surface and is in contact with the fourth, fifth, and sixth surfaces.   
     
     
         26 . The multilayer electronic component of  claim 19 , wherein the first internal electrodes are spaced out from the fourth, fifth, and sixth surfaces of the body and is exposed through the third surface, and
 the second internal electrodes are spaced out from the third, fifth, and sixth surfaces and is exposed through the fourth surface.   
     
     
         27 . The multilayer electronic component of  claim 19 , wherein the first external electrode comprises a first electrode layer in contact with the first internal electrodes, and a first conductive resin layer disposed on the first electrode layer, and
 the second external electrode comprises a second electrode layer in contact with the second internal electrodes, and a second conductive resin layer disposed on the second electrode layer.   
     
     
         28 . The multilayer electronic component of  claim 27 , wherein the first and second electrode layers comprise a conductive metal and glass. 
     
     
         29 . The multilayer electronic component of  claim 27 , wherein the first and second conductive resin layers comprise a conductive metal and resin. 
     
     
         30 . The multilayer electronic component of  claim 27 , further comprising a conductive layer disposed on each of the first and second conductive resin layers. 
     
     
         31 . The multilayer electronic component of  claim 19 , wherein the oxide layer is hydrophobic. 
     
     
         32 . The multilayer electronic component of  claim 19 , wherein a weight percentage of the rare-earth oxide in the dielectric layers with respect to the total weight of the dielectric layers is less than a weight percentage of the rare-earth oxide in the oxide layer with respect to the total weight of the oxide layer. 
     
     
         33 . The multilayer electronic component of  claim 19 , wherein an average thickness of the dielectric layers is 0.4 μm or less. 
     
     
         34 . The multilayer electronic component of  claim 19 , wherein an average thickness of the first and second internal electrodes is 0.4 μm or less. 
     
     
         35 . The multilayer electronic component of  claim 19 , wherein an average thickness of the dielectric layers is 0.4 μm or less, and
 an average thickness of the first and second internal electrodes is 0.4 μm or less. 
 
     
     
         36 . A multilayer electronic component, comprising:
 a body comprising a capacitance-generating portion including dielectric layers and first and second internal electrodes alternately laminated in one direction with respective dielectric layers interposed therebetween, and cover portions respectively disposed on an upper portion and a lower portion of the capacitance-generating portion, the body having first and second surfaces opposing each other in the one direction, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other;   an oxide layer disposed on at least one surface of any one of the first, second, fifth or sixth surface, being spaced apart from the first and second internal electrodes, and comprising dysprosium oxide;   a first external electrode disposed on the third surface and connected to the first internal electrodes; and   a second external electrode disposed on the fourth surface and connected to the second internal electrodes,   wherein a thickness of the oxide layer is less than that of the cover portions.   
     
     
         37 . The multilayer electronic component of  claim 36 , wherein a thickness of the oxide layer is at least 100 nm. 
     
     
         38 . The multilayer electronic component of  claim 37 , wherein the thickness of the oxide layer is 100 μm or less. 
     
     
         39 . The multilayer electronic component of  claim 36 , wherein the oxide layer further comprises a same material as the dielectric layers. 
     
     
         40 . The multilayer electronic component of  claim 36 , wherein the first internal electrodes are spaced out from the fourth surface of the body and is in contact with the third, fifth, and sixth surfaces, and
 the second internal electrodes are spaced out from the third surface and is in contact with the fourth, fifth, and sixth surfaces.   
     
     
         41 . The multilayer electronic component of  claim 36 , wherein the first internal electrodes are spaced out from the fourth, fifth, and sixth surfaces of the body and is exposed through the third surface, and
 the second internal electrodes are spaced out from the third, fifth, and sixth surfaces and is exposed through the fourth surface.   
     
     
         42 . The multilayer electronic component of  claim 36 , wherein the first external electrode comprises a first electrode layer in contact with the first internal electrodes, and a first conductive resin layer disposed on the first electrode layer, and
 the second external electrode comprises a second electrode layer in contact with the second internal electrodes, and a second conductive resin layer disposed on the second electrode layer.   
     
     
         43 . The multilayer electronic component of  claim 42 , wherein the first and second electrode layers comprise a conductive metal and glass. 
     
     
         44 . The multilayer electronic component of  claim 42 , wherein the first and second conductive resin layers comprise a conductive metal and resin. 
     
     
         45 . The multilayer electronic component of  claim 42 , further comprising a conductive layer disposed on each of the first and second conductive resin layers. 
     
     
         46 . The multilayer electronic component of  claim 36 , wherein the oxide layer is hydrophobic. 
     
     
         47 . The multilayer electronic component of  claim 36 , wherein a weight percentage of the rare-earth oxide in the dielectric layers with respect to the total weight of the dielectric layers is less than a weight percentage of the rare-earth oxide in the oxide layer with respect to the total weight of the oxide layer. 
     
     
         48 . The multilayer electronic component of  claim 36 , wherein an average thickness of the dielectric layers is 0.4 μm or less. 
     
     
         49 . The multilayer electronic component of  claim 36 , wherein an average thickness of the first and second internal electrodes is 0.4 μm or less. 
     
     
         50 . The multilayer electronic component of  claim 36 , wherein an average thickness of the dielectric layers is 0.4 μm or less, and
 an average thickness of the first and second internal electrodes is 0.4 μm or less.