Electronic device

Abstract

An electronic device is provided in this disclosure. In some embodiments, the electronic device includes a first substrate and a second substrate adjacent to the first substrate. In some embodiments, the electronic device includes a plurality of organic light emitting diodes, a filter layer, and a third substrate. At least a part of the plurality of organic light emitting diodes are disposed on the first substrate. The filter layer is disposed at least on the second substrate. The third substrate is disposed corresponding to the first substrate and the second substrate. The plurality of organic light emitting diodes and the filter layer are disposed under the third substrate.

What is claimed is: 
     
         1 . An electronic device, comprising:
 a first substrate and a second substrate adjacent to the first substrate;   a plurality of organic light emitting diodes, wherein at least a part of the plurality of organic light emitting diodes are disposed on the first substrate;   a filter layer disposed at least on the second substrate; and   a third substrate disposed corresponding to the first substrate and the second substrate,   wherein the plurality of organic light emitting diodes and the filter layer are disposed under the third substrate.   
     
     
         2 . The electronic device according to  claim 1 , wherein the third substrate is overlapped with the first substrate and the second substrate. 
     
     
         3 . The electronic device according to  claim 1 , wherein a gap exists between the first substrate and the second substrate. 
     
     
         4 . The electronic device according to  claim 1 , further comprising:
 an adhesive element disposed on the second substrate.   
     
     
         5 . The electronic device according to  claim 4 , wherein a part of the adhesive element is disposed between the filter layer and the second substrate. 
     
     
         6 . The electronic device according to  claim 1 , further comprising:
 a circuit structure disposed on the first substrate, wherein the circuit structure is electrically connected with the at least a part of the plurality of organic light emitting diodes.   
     
     
         7 . The electronic device according to  claim 6 , wherein the circuit structure comprises a thin film transistor. 
     
     
         8 . The electronic device according to  claim 1 , further comprising:
 an isolation structure, wherein at least a part of the isolation structure is disposed on the second substrate and disposed adjacent to the filter layer.   
     
     
         9 . The electronic device according to  claim 8 , wherein the isolation structure comprises black matrix resist.