US2023230893A1PendingUtilityA1

Semiconductor Device and Method of Stabilizing Heat Spreader on Semiconductor Package

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Assignee: STATS CHIPPAC PTE LTDPriority: Jan 17, 2022Filed: Jan 17, 2022Published: Jul 20, 2023
Est. expiryJan 17, 2042(~15.5 yrs left)· nominal 20-yr term from priority
Inventors:Soojung ParkKyuwon LeeHyunkyum KimJiwon JangJeehyun Hong
H10W 95/00H10W 72/071H10W 70/481H10W 70/68H10W 40/60H10W 74/129H10W 40/22H10W 40/037H10W 40/641H01L 23/367H01L 21/50
51
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Claims

Abstract

A semiconductor device has an electrical component and heat sink disposed over the electrical component. A portion of the heat sink extends at least partially down a side surface of the electrical component to prevent lateral movement of the heat sink with respect to the semiconductor die. Alternatively, a portion of the heat sink extends at least partially below a surface of the electrical component. The heat sink can have an angled side, extension, or indentation to stabilize the heat sink on the electrical component to prevent rotation or otherwise shifting position that would impart movement in the lateral direction and possibly contact adjacent components or create defects on the PCB. The portion of the heat sink extending at least partially down does so on at least two side surfaces of the electrical component. The electrical component can be a flipchip semiconductor die.

Claims

exact text as granted — not AI-modified
What is claimed: 
     
         1 . A method of making a semiconductor device, comprising:
 providing an electrical component; and   disposing a heat sink over the electrical component, wherein a portion of the heat sink extends at least partially down a side surface of the electrical component to prevent lateral movement of the heat sink with respect to the semiconductor die.   
     
     
         2 . The method of  claim 1 , wherein the heat sink includes an angled side. 
     
     
         3 . The method of  claim 1 , wherein the heat sink includes an extension. 
     
     
         4 . The method of  claim 1 , wherein the heat sink includes an indentation. 
     
     
         5 . The method of  claim 1 , further including disposing a thermal interface layer between the electrical component and heat sink. 
     
     
         6 . The method of  claim 1 , wherein the portion of the heat sink extends at least partially down at least two side surfaces of the electrical component. 
     
     
         7 . A method of making a semiconductor device, comprising:
 providing an electrical component; and   disposing a heat sink over the electrical component, wherein a portion of the heat sink extends at least partially below a surface of the electrical component.   
     
     
         8 . The method of  claim 7 , wherein the heat sink includes an angled side. 
     
     
         9 . The method of  claim 7 , wherein the heat sink includes an extension. 
     
     
         10 . The method of  claim 7 , wherein the heat sink includes an indentation. 
     
     
         11 . The method of  claim 7 , further including disposing a thermal interface layer between the electrical component and heat sink. 
     
     
         12 . The method of  claim 7 , wherein the portion of the heat sink extends at least partially down at least two side surfaces of the electrical component. 
     
     
         13 . The method of  claim 7 , wherein the electrical component includes a flipchip semiconductor die. 
     
     
         14 . A semiconductor device, comprising:
 an electrical component; and   a heat sink disposed over the electrical component, wherein a portion of the heat sink extends at least partially down a side surface of the electrical component to prevent lateral movement of the heat sink with respect to the semiconductor die.   
     
     
         15 . The semiconductor device of  claim 14 , wherein the heat sink includes an angled side. 
     
     
         16 . The semiconductor device of  claim 14 , wherein the heat sink includes an extension. 
     
     
         17 . The semiconductor device of  claim 14 , wherein the heat sink includes an indentation. 
     
     
         18 . The semiconductor device of  claim 14 , wherein the portion of the heat sink extends at least partially down at least two side surfaces of the electrical component. 
     
     
         19 . The semiconductor device of  claim 14 , wherein the electrical component includes a flipchip semiconductor die. 
     
     
         20 . A semiconductor device, comprising:
 an electrical component; and   a heat sink disposed over the electrical component, wherein a portion of the heat sink extends at least partially below a surface of the electrical component.   
     
     
         21 . The semiconductor device of  claim 20 , wherein the heat sink includes an angled side. 
     
     
         22 . The semiconductor device of  claim 20 , wherein the heat sink includes an extension. 
     
     
         23 . The semiconductor device of  claim 20 , wherein the heat sink includes an indentation. 
     
     
         24 . The semiconductor device of  claim 20 , wherein the portion of the heat sink extends at least partially down at least two side surfaces of the electrical component. 
     
     
         25 . The semiconductor device of  claim 20 , wherein the electrical component includes a flipchip semiconductor die.

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