Electronic device

Abstract

The present disclosure provides an electronic device including a driving circuit substrate, a plurality of chips, and a passivation layer. The driving circuit substrate includes a plurality of active elements. The chips are disposed on the driving circuit substrate and electrically connected to the driving circuit substrate. The passivation layer covers the plurality of chips and the driving circuit substrate. The passivation layer has a first part on one of the plurality of chips and a second part on a part of the driving circuit substrate, the second part is not overlapped with the plurality of chips, and a first thickness of the first part is less than a second thickness of the second part. The first space between adjacent two of the plurality of chips is different from a second space between another adjacent two of the plurality of chips.

What is claimed is: 
     
         1 . An electronic device, comprising:
 a driving circuit substrate comprising a plurality of active elements;   a plurality of chips disposed on the driving circuit substrate and electrically connected to the driving circuit substrate; and   a passivation layer covering the plurality of chips and the driving circuit substrate,   wherein the passivation layer has a first part on one of the plurality of chips and a second part on a part of the driving circuit substrate, the second part is not overlapped with the plurality of chips, and a first thickness of the first part is less than a second thickness of the second part; and   wherein a first space between adjacent two of the plurality of chips is different from a second space between another adjacent two of the plurality of chips.   
     
     
         2 . The electronic device of  claim 1 , wherein the first thickness is greater than 1 micrometer. 
     
     
         3 . The electronic device of  claim 1 , wherein the first part is directly on the one of the plurality of chips, and the second part is directly on the part of the driving circuit substrate. 
     
     
         4 . The electronic device of  claim 3 , wherein the passivation layer directly contacts a top surface and two side surfaces of the one of the plurality of chips. 
     
     
         5 . The electronic device of  claim 1 , wherein one of the plurality of active elements comprises a transistor. 
     
     
         6 . The electronic device of  claim 1 , further comprising a non-self-emissive panel and a backlight module, wherein the backlight module comprises the driving circuit substrate, the plurality of chips, and the passivation layer. 
     
     
         7 . The electronic device of  claim 1 , wherein the passivation layer comprises epoxy resin. 
     
     
         8 . The electronic device of  claim 1 , further comprising a wall structure, wherein the wall structure has a plurality of openings, and at least one of the plurality of chips is disposed in one of the plurality of openings. 
     
     
         9 . The electronic device of  claim 1 , further comprising a diffuser plate and a brightness enhancement film disposed on the plurality of chips.