Mechanically reinforced electrical packages

Abstract

An electrical package can include a substrate having a first side and a second side opposite the first side. One or more electrical components mounted to the substrate, and a plurality of electrically conductive interconnect members can be coupled to the second side of the substrate. At least one of the interconnect members can have an elongated shape with a length that is longer than a width. The interconnect member with the elongated shape positioned can be at or proximate one of the corners. The interconnect members can be arranged as a grid, with first interconnect members each occupying a single grid cell, and second interconnect members each occupying at least two grid cells. The second interconnect members can have a shape of two of the first interconnect members coupled by a bridge portion.

The following is claimed: 
     
         1 . An electrical package comprising:
 a substrate having a first side and a second side opposite the first side;   one or more electrical components mounted to the substrate; and   a plurality of electrically conductive interconnect members arranged as a two-dimensional array on the second side of the substrate, including a plurality of the interconnect members that each occupy one array location, and at least one of the interconnect members that occupies at least two array locations.   
     
     
         2 . The electrical package of  claim 1  wherein the one or more electrical components are mounted to the first side of the substrate, and having one or more additional electrical components mounted to the second side of the substrate. 
     
     
         3 . The electrical package of  claim 2  further comprising a mold structure extending over at least part of the second side of the substrate and at least partially surrounding the one or more additional electrical components. 
     
     
         4 . The electrical package of  claim 3  further comprising a mold structure extending over at least part of the first side of the substrate and at least partially surrounding the one or more electrical components. 
     
     
         5 . The electrical package of  claim 1  wherein the package is a dual-sided molded package. 
     
     
         6 . The electrical package of  claim 1  wherein the interconnect members that occupy one array location have a generally circular shape. 
     
     
         7 . The electrical package of  claim 1  wherein the substrate has a generally rectangular shape in plan view with four corners, with the at least one interconnect member that occupies at least two array locations positioned at or proximate to at least one of the corners. 
     
     
         8 . The electrical package of  claim 1  wherein the at least one interconnect member that occupies at least two array locations is a furthest interconnection member from a center of the package. 
     
     
         9 . The electrical package of  claim 1  wherein the at least one interconnect member that occupies at least two array locations has a length L that is substantially equal to n·W + (n-1) · G, where n is a positive integer, W is the width of the interconnect members, and G is a distance between adjacent interconnect members. 
     
     
         10 . The electrical package of  claim 1  wherein the second interconnect member has a generally capsular shape. 
     
     
         11 . An electrical package comprising:
 a substrate having a first side, a second side opposite the first side, and at least one corner;   one or more electrical components mounted to the substrate; and   a plurality of electrically conductive interconnect members coupled to the second side of the substrate, including at least one of the interconnect members that is closest to the corner and has a larger size than inner interconnect members that are positioned further inward away from the corner.   
     
     
         12 . The electrical package of  claim 11  wherein the one or more electrical components are mounted to the first side of the substrate, and having one or more additional electrical components mounted to the second side of the substrate. 
     
     
         13 . The electrical package of  claim 12  further comprising a mold structure extending over at least part of the second side of the substrate and at least partially surrounding the one or more additional electrical components. 
     
     
         14 . The electrical package of  claim 13  further comprising a mold structure extending over at least part of the first side of the substrate and at least partially surrounding the one or more electrical components. 
     
     
         15 . The electrical package of  claim 11  wherein at least some of the inner interconnect members have a generally circular shape. 
     
     
         16 . The electrical package of  claim 11  wherein the at least one interconnect member that is closest to the corner has a generally capsular shape. 
     
     
         17 . The electrical package of  claim 11  wherein the interconnect members are arranged as a grid, with at least some of the inner interconnect members occupying a single grid cell, and the interconnect member that is closest to the corner occupying at least two grid cells. 
     
     
         18 . An electrical package comprising:
 a substrate having a first side and a second side opposite the first side;   one or more electrical components mounted to the substrate; and   a plurality of electrically conductive interconnect members coupled to the second side of the substrate, including at least one of the interconnect members that is furthest from a center of the substrate and has a larger size than others of the interconnect members that are positioned closer to the center.   
     
     
         19 . The electrical package of  claim 18  wherein the one or more electrical components are mounted to the first side of the substrate, and having one or more additional electrical components mounted to the second side of the substrate. 
     
     
         20 . The electrical package of  claim 19  further comprising a mold structure extending over at least part of the second side of the substrate and at least partially surrounding the one or more additional electrical components. 
     
     
         21 . The electrical package of  claim 20  further comprising a mold structure extending over at least part of the first side of the substrate and at least partially surrounding the one or more electrical components. 
     
     
         22 . The electrical package of  claim 18  wherein at least some of the others of the interconnect members have a generally circular shape. 
     
     
         23 . The electrical package of  claim 18  wherein the at least one interconnect member that is furthest from the center has a generally capsular shape. 
     
     
         24 . The electrical package of  claim 18  wherein the at least one interconnect member that is furthest from the center is positioned at or proximate to a corner of the package. 
     
     
         25 . The electrical package of  claim 18  wherein the interconnect members are arranged as a grid, with at least some of the other interconnect members each occupying a single grid cell, and the interconnect member that is furthest from the center occupying at least two grid cells.