Compositions containing thermally conductive fillers

Abstract

Disclosed is a composition comprising a molecule comprising an electrophilic functional group, optionally a second molecule comprising a nucleophilic functional group, and a thermally conductive filler package. The filler package may comprise thermally conductive, electrically insulative filler particles that may have a thermal conductivity of at least 5 W/m·K (measured according to ASTM D7984) and a volume resistivity of at least 10 Ω·m (measured according to ASTM D257, C611, or B193) and that may be present in an amount of at least 50% by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of at least 10% by volume percent based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a compositions disclosed herein.

1 . A composition, comprising:
 a molecule comprising an electrophilic functional group; and   a thermally conductive filler package comprising thermally conductive, electrically insulative filler particles comprising a thermal conductivity of at least 5 W/m·K (measured according to ASTM D7984) and a volume resistivity of at least 1 Ω·m (measured according to ASTM D257),   wherein the composition comprises the thermally conductive, electrically insulative filler particles in an amount of at least 50% by volume based on total volume of the filler package, and   wherein the thermally conductive, electrically insulative filler particles comprise thermally stable filler particles.   
     
     
         2 . The composition of  claim 1 , wherein the composition comprises a viscosity of 10 cP to 10 8  cP at a shear stress of 800 Pa as measured by a rotational rheometer at 25° C. using a parallel plate with a diameter of 25 mm (1 mm gap). 
     
     
         3 - 5 . (canceled) 
     
     
         6 . The composition of  claim 1 , further comprising a second molecule comprising a nucleophilic functional group. 
     
     
         7 - 8 . (canceled) 
     
     
         9 . The composition of  claim 1 , wherein the composition comprises the molecule comprising the electrophilic functional groups is present in an amount of 1% by volume to 90% by volume based on total volume of the composition. 
     
     
         10 . The composition of  claim 6 , wherein the composition comprises the second molecule comprising the nucleophilic functional group is in an amount of 0.1% by volume to 89% by volume based on total volume of the composition. 
     
     
         11 . The composition of  claim 1 , wherein the molecule comprising the electrophilic functional groups comprises an epoxy-containing compound, a carbonate-containing compound, an isocyanate-containing compound, or combinations thereof. 
     
     
         12 - 13 . (canceled) 
     
     
         14 . The composition of  claim 6 , wherein the second molecule comprises an amine, a thiol, a polyol, a carboxylic acid, an anhydride, or combinations thereof. 
     
     
         15 . The composition of  claim 6 , wherein the nucleophilic functional group is blocked or wherein the nucleophilic functional group is unblocked or wherein the second molecule is encapsulated or wherein the second molecule is unencapsulated. 
     
     
         16 . The composition of  claim 1 , wherein the composition comprises the thermally conductive filler package is present in an amount of 10% by volume to 98% by volume based on total volume of the composition. 
     
     
         17 . (canceled) 
     
     
         18 . The composition of  claim 1 , wherein the filler package further comprises (a) thermally conductive, electrically conductive filler particles having a thermal conductivity of at least 5 W/m·K (measured according to ASTM D7984) and a volume resistivity of less than 1 Ω·m (measured according to ASTM D257), in an amount of no more than 10% by volume based on total volume of the filler package and/or (b) non-thermally conductive, electrically insulative filler particles having a thermal conductivity of less than 5 W/m·K (measured according to ASTM D7984) and a volume resistivity of at least 1 Ω·m (measured according to ASTM D257) in an amount of no more than 1% by volume based on total volume of the filler package. 
     
     
         19 . The composition of  claim 1 , further comprising thermally unstable filler particles, a dispersant, a reactive diluent and/or an additive. 
     
     
         20 - 23 . (canceled) 
     
     
         24 . A method of treating a substrate comprising:
 contacting at least a portion of a surface of the substrate with the composition of  claim 1 ;   wherein the composition, in an at least partially cured state, forms a coating.   
     
     
         25 . (canceled) 
     
     
         26 . The substrate of claim  45 , wherein the coating, in an at least partially cured state:
 (a) comprises a thermal conductivity of at least 0.5 W/m·K as measured using a Modified Transient Plane Source (MTPS) method (conformed to ASTM D7984) with a TCi thermal conductivity analyzer from C-Therm Technologies Ltd.;   (b) comprises a volume resistivity of at least 1 × 10 9  Ω·m (measured according to ASTM D257, C611, or B193) on a Keysight B2987A Electrometer/High Resistance Meter connected to a 16008B Resistivity Cell;   (c) comprises a dielectric strength of at least 1 kV/mm measured according to ASTM D149 on a dielectric meter (Sefelec RMG12AC-DC) connected to two copper electrodes with 1 inch diameter;   (d)comprises a Shore A hardness 5 to 95 measured according to ASTM D2240 with a Type A durometer (Model 2000, Rex Gauge Company, Inc.) at room temperature;   (e) comprises a Shore D hardness of 5 to 95, measured according to ASTM D2240 standard with a Type D durometer (Model 2000, Rex Gauge Company, Inc.) at room temperature;   (f) comprises a Shore OO hardness of less than 90 measured according to ASTM D2240 with a Type OO durometer (Model AD-100-OO, Checkline);   (g) comprises a tensile strength of 0.01 MPa to 1,000 MPa, as determined according to ASTM D412 using an Instron 5567 machine in tensile mode with a pull rate of 1 mm per minute;   (h) comprises an elongation of 1% to 300%;   (i) comprises a lap shear strength of at least 0.01 MPa (measured according to ASTM D1002-10 using an Instron 5567 machine in tensile mode with a pull rate of 1 mm per minute);   (j) comprises a butt joint test strength of 0.001 N/mm 2  to 500 N/mm 2  (measured according to ASTM D2095);   (k) comprises a sound damping loss factor of at least 0.1 at 20° C. and 200 Hz, 4 kg/m 2 , using the Oberst test method;   (1) maintains a temperature of the substrate that is at least 100° C. lower following exposure of the coating on the surface of the substrate to 1000° C. for at a time of at least 90 seconds than a surface temperature of a bare substrate exposed to 1000° C. for the time;   (g) provides a substrate with thermal and fire protection;   (h) does not smoke upon exposure of the substrate to 1000° C. for 500 sec; and/or   (i) exhibits no visible cracking or delamination upon exposure of the substrate to 1000° C. for 500 sec.   
     
     
         27 - 31 . (canceled) 
     
     
         32 . The substrate of of claim  45 , wherein the substrate comprises a vehicle, a part, an article, an appliance, a battery cell, a personal electronic device, a circuit board, a multi-metal article, or combinations thereof. 
     
     
         33 . The substrate of  claim 32 , wherein the vehicle comprises an automobile or an aircraft and/or the part comprises a thermally conductive part. 
     
     
         34 . A battery assembly comprising:
 a battery cell; and   a coating, in an at least partially cured state, formed on a surface of the battery cell from the composition of  claim 1 .   
     
     
         35 . The battery assembly of  claim 33 , wherein the coating, in an at least partially cured state:
 (a) comprises a thermal conductivity of at least 0.5 W/m·K as measured using a Modified Transient Plane Source (MTPS) method (conformed to ASTM D7984) with a TCi thermal conductivity analyzer from C-Therm Technologies Ltd.;   (b) comprises a volume resistivity of at least 1 × 10 9  Ω·m (measured according to ASTM D257, C611, or B193) on a Keysight B2987A Electrometer/High Resistance Meter connected to a 16008B Resistivity Cell;   (c) comprises a dielectric strength of at least 1 kV/mm measured according to ASTM D149 on a dielectric meter (Sefelec RMG12AC-DC) connected to two copper electrodes with 1 inch diameter;   (d) comprises a Shore A hardness 5 to 95 measured according to ASTM D2240 with a Type A durometer (Model 2000, Rex Gauge Company, Inc.) at room temperature;   (e) comprises a Shore D hardness of 5 to 95, measured according to ASTM D2240 standard with a Type D durometer (Model 2000, Rex Gauge Company, Inc.) at room temperature;   (f) comprises a Shore OO hardness of less than 90 measured according to ASTM D2240 with a Type OO durometer (Model AD-100-00, Checkline);   (g )comprises a tensile strength of 0.01 MPa to 1,000 MPa, as determined according to ASTM D412 using an Instron 5567 machine in tensile mode with a pull rate of 1 mm per minute;   (h) comprises an elongation of 1% to 300%;   (i) comprises a lap shear strength of at least 0.01 MPa (measured according to ASTM D1002-10 using an Instron 5567 machine in tensile mode with a pull rate of 1 mm per minute);   (j) comprises a butt joint test strength of 0.001 N/mm 2  to 500 N/mm 2  (measured according to ASTM D2095);   (k) comprises a sound damping loss factor of at least 0.1 at 20° C. and 200 Hz, 4 kg/m 2 , using the Oberst test method;   (1) maintains a temperature of the substrate that is at least 100° C. lower following exposure of the coating on the surface of the substrate to 1000° C. for at a time of at least 90 seconds than a surface temperature of a bare substrate exposed to 1000° C. for the time;   (g) provides a substrate with thermal and fire protection;   (h) does not smoke upon exposure of the substrate to 1000° C. for 500 sec; and/or   (i) exhibits no visible cracking or delamination upon exposure of the substrate to 1000° C. for 500 sec.   
     
     
         36 - 39 . (canceled) 
     
     
         40 . A method of forming an article comprising extruding the composition of  claim 1 . 
     
     
         41 - 45 . (canceled) 
     
     
         46 . A substrate comprising a coating formed from the composition of  claim 1 . 
     
     
         47 . A gap filler formed from the composition of  claim 1 . 
     
     
         48 . A battery assembly comprising the thermal gap filler of  claim 47 .