Atomizer and electronic atomization device having same

Abstract

A vaporizer includes: a liquid storage tank for storing liquid; a mounting base including a leaked liquid buffer structure having a capillary force; and a vaporization core including a porous substrate and a heating element, the porous substrate being in fluid communication with the liquid storage tank and absorbing liquid from the liquid storage tank through a capillary force, the heating element heating and vaporizing the liquid of the porous substrate. The vaporization core is located between the liquid storage tank and the leaked liquid buffer structure. The leaked liquid buffer structure abuts the porous substrate and receives the liquid overflowed from the porous substrate.

What is claimed is: 
     
         1 . A vaporizer, comprising:
 a liquid storage tank configured to store liquid;   a mounting base comprising a leaked liquid buffer structure having a capillary force; and   a vaporization core comprising a porous substrate and a heating element, the porous substrate being in fluid communication with the liquid storage tank and configured to absorb liquid from the liquid storage tank through a capillary force, the heating element being configured to heat and vaporize the liquid of the porous substrate,   wherein the vaporization core is located between the liquid storage tank and the leaked liquid buffer structure, and   wherein the leaked liquid buffer structure abuts the porous substrate and is configured to receive the liquid overflowed from the porous substrate.   
     
     
         2 . The vaporizer of  claim 1 , wherein the capillary force of the porous substrate is greater than the capillary force of the leaked liquid buffer structure, and
 wherein, when the heating element heats and vaporizes the liquid of the porous substrate, the liquid received by the leaked liquid buffer structure refluxes to the porous substrate and is heated and vaporized.   
     
     
         3 . The vaporizer of  claim 1 , wherein the mounting base comprises a vaporization cavity,
 wherein the vaporization core is accommodated in the vaporization cavity, and   wherein the leaked liquid buffer structure is connected to a bottom of the vaporization cavity and is configured to absorb liquid deposited at the bottom of the vaporization cavity through a capillary force.   
     
     
         4 . The vaporizer of  claim 1 , wherein the mounting base comprises an upper base body and a lower base body, a liquid flowing hole being provided on the upper base body,
 wherein the liquid in the liquid storage tank flows to the porous substrate through the liquid flowing hole,   wherein the leaked liquid buffer structure is provided on the lower base body,   wherein the porous substrate comprises a liquid absorbing surface and a vaporization surface, the liquid absorbing surface being connected to the liquid flowing hole,   wherein the heating element is provided on the vaporization surface, and   wherein surfaces other than the liquid absorbing surface and the vaporization surface of the porous substrate are in contact with the leaked liquid buffer structure.   
     
     
         5 . The vaporizer of  claim 1 , wherein, when an air pressure in the liquid storage tank increases, the liquid is pressed to overflow to the porous substrate such that the porous substrate overflows redundant liquid, and
 wherein the leaked liquid buffer structure is configured to receive and lock the redundant liquid, and   wherein, when the air pressure in the liquid storage tank decreases, the redundant liquid refluxes to the liquid storage tank through the porous substrate.   
     
     
         6 . The vaporizer of  claim 1 , wherein the leaked liquid buffer structure comprises a first capillary groove, one end of the first capillary groove being in contact with the porous substrate, and an other end of the first capillary groove extending to the bottom of the vaporization cavity. 
     
     
         7 . The vaporizer of  claim 6 , wherein the leaked liquid buffer structure further comprises a second capillary groove provided on the bottom of the vaporization cavity, and
 wherein the second capillary groove is in communication with the first capillary groove.   
     
     
         8 . The vaporizer of  claim 1 , wherein the leaked liquid buffer structure comprises a capillary hole, one end of the capillary hole being in contact with the porous substrate, and an other end of the capillary hole extending to the bottom of the vaporization cavity. 
     
     
         9 . The vaporizer of  claim 8 , wherein the leaked liquid buffer structure further comprises a second capillary groove provided on the bottom of the vaporization cavity, and
 wherein the second capillary groove is in communication with the capillary hole.   
     
     
         10 . The vaporizer of  claim 1 , wherein a material of the leaked liquid buffer structure comprises a porous material. 
     
     
         11 . The vaporizer of  claim 10 , wherein the porous material comprises a hard porous material, and
 wherein the leaked liquid buffer structure is configured to support the vaporization core.   
     
     
         12 . The vaporizer of  claim 11 , wherein the leaked liquid buffer structure comprises a U-shaped structure. 
     
     
         13 . The vaporizer of  claim 11 , wherein the hard porous material comprises at least one of a porous ceramic or a porous metal. 
     
     
         14 . The vaporizer of  claim 10 , wherein the porous material comprises a soft porous material, and
 wherein the leaked liquid buffer structure is supported by a support portion such that one end of the leaked liquid buffer structure is in contact with the porous substrate, and an other end extends to the bottom of the vaporization cavity.   
     
     
         15 . The vaporizer of  claim 14 , wherein the soft porous material comprises at least one of cotton, fiber, or liquid absorbing resin. 
     
     
         16 . The vaporizer of  claim 1 , wherein the porous substrate comprises an e-liquid transmission portion and a protruding portion integrally formed on one side of the e-liquid transmission portion, and
 wherein the leaked liquid buffer structure is provided on an edge of the e-liquid transmission portion and provided at intervals with the protruding portion.   
     
     
         17 . The vaporizer of  claim 1 , wherein the porous substrate comprises a porous ceramic or a porous metal. 
     
     
         18 . An electronic vaporization device, comprising:
 a power supply component; and   the vaporizer of  claim 1 .   
     
     
         19 . An electronic vaporization device, comprising:
 a liquid storage tank configured to store liquid;   a mounting base comprising a leaked liquid buffer structure having a capillary force;   a vaporization core comprising a porous substrate and a heating element, the porous substrate being in fluid communication with the liquid storage tank and configured to absorb liquid from the liquid storage tank through a capillary force, and the heating element being configured to heat and vaporizing the liquid of the porous substrate; and   a power supply component configured to supply power to the vaporization core,   wherein the vaporization core is located between the liquid storage tank and the leaked liquid buffer structure, and   wherein the leaked liquid buffer structure abuts the porous substrate and is configured to receive the liquid overflowed from the porous substrate.   
     
     
         20 . The electronic vaporization device of  claim 19 , wherein the capillary force of the porous substrate is greater than the capillary force of the leaked liquid buffer structure, and
 wherein, when the heating element heats and vaporizes the liquid of the porous substrate, the liquid received by the leaked liquid buffer structure refluxes to the porous substrate and is heated and vaporized.   
     
     
         21 . The electronic vaporization device of  claim 19 , wherein the mounting base comprises a vaporization cavity,
 wherein the vaporization core is accommodated in the vaporization cavity, and   wherein the leaked liquid buffer structure is connected to a bottom of the vaporization cavity and configured to absorb liquid deposited at the bottom of the vaporization cavity through a capillary force.   
     
     
         22 . The electronic vaporization device of  claim 19 , wherein the mounting base comprises an upper base body and a lower base body, a liquid flowing hole being provided on the upper base body is provided with,
 wherein the liquid in the liquid storage tank flows to the porous substrate through the liquid flowing hole,   wherein the leaked liquid buffer structure is provided on the lower base body,   wherein the porous substrate comprises a liquid absorbing surface and a vaporization surface provided opposite to each other, the liquid absorbing surface being connected to the liquid flowing hole, the heating element being provided on the vaporization surface, and   wherein surfaces other than the liquid absorbing surface and the vaporization surface of the porous substrate are in contact with the leaked liquid buffer structure.   
     
     
         23 . The electronic vaporization device of  claim 19 , wherein, when an air pressure in the liquid storage tank increases, the liquid is pressed to overflow to the porous substrate such that the porous substrate overflows redundant liquid,
 wherein the leaked liquid buffer structure is configured to receive and lock the redundant liquid, and   wherein, when the air pressure in the liquid storage tank decreases, the redundant liquid refluxes to the liquid storage tank through the porous substrate.