Method for forming channels in printed circuit boards by stacking slotted layers

Abstract

A process of fabricating an electromagnetic circuit includes providing three laminate sheets, forming a first feature in a first laminate sheet of the three laminate sheets, and forming a second feature in a second laminate sheet of the three laminate sheets. The second feature is aligned with the first feature when aligning the second laminate sheet with the first laminate sheet. The process further includes stacking the three laminate sheets so that the first laminate sheet is positioned above and aligned with the second laminate sheet and the second laminate sheet is positioned above and aligned with the third laminate sheet. The first feature and the second feature define a contiguous element. The process further includes filling the contiguous element with an electrically conductive material to form an electrically continuous conductor.

What is claimed is: 
     
         1 .- 14 . (canceled) 
     
     
         15 . A process of fabricating an electromagnetic circuit, the process comprising:
 providing three laminate sheets, each laminate sheet including a flat sheet of dielectric material having a layer of copper applied to the sheet, the copper layer being formed into conductive lines and traces, including pads and vias;   forming at least one first feature in a first laminate sheet of the three laminate sheets;   forming at least one second feature in a second laminate sheet of the three laminate sheets, the at least one second feature being aligned with the first feature when aligning the second laminate sheet with the first laminate sheet;   stacking the three laminate sheets so that the first laminate sheet is positioned above and aligned with the second laminate sheet and the second laminate sheet is positioned above and aligned with the third laminate sheet, the at least one first feature and the at least one second feature defining a cavity; and   securing an embedded component on a pad within the cavity.   
     
     
         16 . The process of  claim 15 , wherein the at least one first feature is an opening and the at least one second feature is an opening. 
     
     
         17 . (canceled) 
     
     
         18 . The process of  claim 15 , wherein the laminate sheets are stacked with respect to one another manually with the aid of an alignment fixture having pins. 
     
     
         19 . The process of  claim 15 , further comprising, after stacking the laminate sheets, curing the laminate sheets under pressure and temperature to form an integral final product having a uniform thickness. 
     
     
         20 . The process of  claim 15 , further comprising disposing a fourth laminate sheet over the first laminate sheet to embed the embedded component. 
     
     
         21 . The process of  claim 15 , wherein the third laminate sheet is formed with a solid copper layer to create a ground plane. 
     
     
         22 . The process of  claim 21 , wherein the pad is on the third laminate sheet. 
     
     
         23 . The process of  claim 15 , wherein the third laminate sheet includes a conductive trace in communication with the embedded component. 
     
     
         24 . The process of  claim 15 , wherein the copper layer is etched or milled to form a desired electrical pattern. 
     
     
         25 . A process of fabricating an electromagnetic circuit, the process comprising:
 providing three laminate sheets, each laminate sheet including a flat sheet of dielectric material having a layer of copper applied to the sheet, the copper layer being formed into conductive lines and traces, including pads and vias;   forming at least one first feature in a first laminate sheet of the three laminate sheets, the at least one first feature being an opening;   forming at least one second feature in a second laminate sheet of the three laminate sheets, the at least one second feature being an opening, the at least one second feature being aligned with the first feature when aligning the second laminate sheet with the first laminate sheet;   after forming the at least one first feature in the first laminate sheet and the at least one second feature in the second laminate sheet, stacking the three laminate sheets so that the first laminate sheet is positioned above and aligned with the second laminate sheet and the second laminate sheet is positioned above and aligned with a third laminate sheet, the at least one first feature and the at least one second feature defining a contiguous element;   after stacking the three laminate sheets, securing an embedded component on a pad within the cavity; and   disposing a fourth laminate sheet over the first laminate sheet to embed the embedded component.   
     
     
         26 . The process of  claim 25 , wherein the laminate sheets are stacked with respect to one another manually with the aid of an alignment fixture having pins. 
     
     
         27 . The process of  claim 25 , further comprising, after stacking the laminate sheets, curing the laminate sheets under pressure and temperature to form an integral final product having a uniform thickness. 
     
     
         28 . The process of  claim 25 , further comprising disposing a fourth laminate sheet over the first laminate sheet to embed the embedded component. 
     
     
         29 . The process of  claim 25 , wherein the third laminate sheet is formed with a solid copper layer to create a ground plane. 
     
     
         30 . The process of  claim 29 , wherein the pad is on the third laminate sheet. 
     
     
         31 . The process of  claim 25 , wherein the third laminate sheet includes a conductive trace in communication with the embedded component. 
     
     
         32 . The process of  claim 25 , wherein the copper layer is etched or milled to form a desired electrical pattern.