Electronic device including sensor module

Abstract

An electronic device includes a housing including a first area provided to transmit light and a sensor hole formed in the first area. A circuit board is disposed inside the housing, a first sensor is connected to the circuit board, and a shield member is configured to block the sensor hole and provide a heat transfer path from exterior of the housing to the first sensor. A conductive material for heat conduction is disposed on at least a portion of the housing surrounding the sensor hole.

What is claimed is: 
     
         1 . An electronic device comprising:
 a housing including a first area provided to transmit light and a sensor hole formed in the first area;   a circuit board disposed inside the housing;   a first sensor connected to the circuit board; and   a shield member configured to block the sensor hole and provide a heat transfer path from exterior of the housing to the first sensor,   wherein a conductive material for heat conduction is disposed on at least a portion of the housing surrounding the sensor hole.   
     
     
         2 . The electronic device of  claim 1 , wherein the first sensor is a body temperature measurement sensor. 
     
     
         3 . The electronic device of  claim 1 , wherein the sensor hole comprises a first opening area connected to the exterior of the housing and a second opening area extending from the first opening area and connected to interior of the housing,
 the first sensor is disposed within the second opening area, and   the shield member is disposed in the first opening area.   
     
     
         4 . The electronic device of  claim 3 , wherein a width of first opening area is larger than a width of the second opening area. 
     
     
         5 . The electronic device of  claim 1 , further comprising a second sensor connected to the circuit board and disposed adjacent to the first sensor,
 wherein the second sensor comprises a light-emitting element and a light-receiving element.   
     
     
         6 . The electronic device of  claim 5 , wherein the light-emitting element and the light-receiving element are disposed to surround the first sensor. 
     
     
         7 . The electronic device of  claim 5 , wherein the housing further comprises an auxiliary hole provided in the first area and an auxiliary shield member configured to block the auxiliary hole, and
 wherein the light-emitting element is disposed in the auxiliary hole.   
     
     
         8 . The electronic device of  claim 7 , wherein the auxiliary shield member is made of a light-transmitting material, and
 wherein the shield member is made of a light-blocking material.   
     
     
         9 . The electronic device of  claim 5 , wherein the housing comprises a second area disposed to surround the first area and configured to block light, and
 the first sensor and the second sensor are disposed to overlap the first area.   
     
     
         10 . The electronic device of  claim 1 , wherein the first sensor is disposed inside the housing not to overlap the sensor hole, and
 the electronic device further comprises a conductive member extending from at least a partial area of the housing corresponding to the sensor hole to the first sensor.   
     
     
         11 . The electronic device of  claim 1 , further comprising a connector configured to connect with the first sensor and the circuit board. 
     
     
         12 . The electronic device of  claim 9 , wherein the first area and the second area are integrally formed. 
     
     
         13 . An electronic device comprising:
 a housing including a first area provided to transmit light and a sensor hole formed in the first area;   a circuit board disposed inside the housing;   a first sensor electrically connected to the circuit board and disposed inside the housing;   a second sensor disposed to overlap the first area and including a light-emitting element and a light-receiving element; and   a shield member configured to block the sensor hole and provide a heat transfer path from exterior of the housing to the first sensor,   wherein a conductive material for heat conduction is disposed on at least a portion of the housing surrounding the sensor hole.   
     
     
         14 . The electronic device of  claim 13 , wherein the first sensor is a body temperature sensor. 
     
     
         15 . The electronic device of  claim 13 , wherein the light-emitting element and the light-receiving element are disposed to surround the first sensor. 
     
     
         16 . The electronic device of  claim 13 , wherein the housing further comprises a second area disposed around the first area, and
 wherein the second area comprises a light-blocking material to block light incident on the light-receiving element.   
     
     
         17 . The electronic device of  claim 13 , further comprising an optical film disposed adjacent to the light-emitting element. 
     
     
         18 . The electronic device of  claim 17 , wherein the optical film comprises a light-emitting area capable of arranging to overlap the light-emitting element and a light-receiving area capable if arranging to overlap with the light-receiving element, and
 wherein the light-emitting area and the light-receiving area comprise a fresnel structure.   
     
     
         19 . The electronic device of  claim 13 , wherein the first sensor is a non-contact type body temperature sensor, and
 wherein the first sensor is disposed to be spaced apart from the shield member by a predetermined distance.   
     
     
         20 . The electronic device of  claim 13 , wherein the first area is made of at least one of glass, sapphire, plastic, or transparent ceramic.