Semiconductor device and method of manufacturing a semiconductor device

Abstract

A method for forming a packaged electronic device includes providing a substrate having a first major surface and an opposing second major surface. The method includes attaching an electronic device to the first major surface of the substrate and providing a first conductive structure coupled to at least a first portion of the substrate. The method includes forming a dielectric layer overlying at least part of the first conductive structure. The method includes forming a conductive layer overlying the dielectric layer and connected to a second portion of the substrate. The first conductive structure, the dielectric layer, and conductive layer are configured as a capacitor structure and further configured as one or more of an enclosure structure or a stiffener structure for the packaged electronic device.

What is claimed is: 
     
         1 . A packaged electronic device structure, comprising:
 a substrate;   an electronic device coupled to the substrate and comprising side edges;   a first conductive structure coupled to at least a first portion of the substrate;   a dielectric structure overlying at least part of the first conductive structure; and   a second conductive structure overlying the dielectric structure and coupled to a second portion of the substrate, wherein:
 the first conductive structure comprises a continuous portion that is laterally separated from the side edges of the electronic device and that laterally surrounds the electronic device without breaks; and 
 the first conductive structure, the dielectric structure, and the second conductive structure are configured as a capacitor structure and one or more of an enclosure structure or a stiffener structure. 
   
     
     
         2 . The packaged electronic device structure of  claim 1 , wherein:
 the first conductive structure comprises a top portion coupled to the continuous portion;   the top portion overlaps the electronic device;   the top portion is coupled to the electronic device with an attachment material; and   the continuous portion and the top portion comprise a first lid structure that encloses the electronic device.   
     
     
         3 . The packaged electronic device structure of  claim 2 , wherein:
 the second conductive structure comprises a second lid structure; and   the packaged electronic device structure is devoid of an encapsulant that extends from the side edges of the electronic device to the continuous portion.   
     
     
         4 . The packaged electronic device structure of  claim 2 , wherein:
 the top portion comprises a fin structure.   
     
     
         5 . The packaged electronic device structure of  claim 1 , wherein:
 the dielectric structure comprises a 3D printed dielectric structure.   
     
     
         6 . The packaged electronic device structure of  claim 1 , wherein:
 the dielectric structure has a thickness in a range from about 2 microns through about 5 microns.   
     
     
         7 . The packaged electronic device structure of  claim 1 , wherein:
 the first conductive structure, the dielectric structure, and the second conductive structure comprise the capacitor structure and the stiffener structure for the packaged electronic device structure; and   the second conductive structure is coupled to the substrate without overlapping the electronic device.   
     
     
         8 . The packaged electronic device structure of  claim 7 , further comprising:
 a third conductive structure coupled to the substrate;   wherein:
 the third conductive structure is laterally separated from the continuous portion by a gap; and 
 the second conductive structure comprises:
 a first portion coupled to the dielectric structure; 
 a second portion over the gap; and 
 a third portion coupled to the third conductive structure. 
 
   
     
     
         9 . The packaged electronic device structure of  claim 8 , wherein:
 the second conductive structure and the third conductive structure comprise a single-piece structure.   
     
     
         10 . The packaged electronic device structure of  claim 1 , wherein:
 the first conductive structure comprises a single-piece lid structure comprises the continuous portion and a top portion; and   the continuous portion extends from the top portion to vertically overlap the side edges of the electronic device to form an enclosure structure that vertically and horizontally covers the electronic device.   
     
     
         11 . A packaged electronic device, comprising:
 a substrate;   an electronic device coupled to the substrate, the electronic device comprising side edges;   a single-piece lid structure coupled to the substrate and coupled to the electronic device with an attachment material, the single-piece lid structure comprising a conductive structure having a top portion and a side portion that extends from the top portion, wherein:
 the single-piece lid structure forms an enclosure structure that vertically and horizontally encloses the electronic device; and 
   a dielectric structure over the single-piece lid structure; and   a conductive structure over the dielectric structure and coupled to the substrate, wherein:
 the single-piece lid structure form a first capacitive plate; 
 the dielectric structure forms a capacitor dielectric; 
 the conductive structure forms a second capacitive plate; and 
 the first capacitive plate, the capacitor dielectric, and the second capacitive plate form a capacitor structure for the packaged electronic device. 
   
     
     
         12 . The packaged electronic device of  claim 11 , wherein:
 the side portion comprises a continuous portion that laterally surrounds the side edges of the electronic device without a break.   
     
     
         13 . The packaged electronic device of  claim 11 , wherein:
 the single-piece lid structure comprises one or more fin structures extending outward from the top portion in a direction perpendicular from, overlying, and above a top side of the electronic device.   
     
     
         14 . The packaged electronic device of  claim 11 , wherein:
 the conductive structure comprises a 3D printed structure.   
     
     
         15 . The packaged electronic device of  claim 11 , wherein
 the dielectric structure has a thickness in a range from about 2 microns through about 5 microns.   
     
     
         16 . A packaged electronic device, comprising:
 a substrate;   an electronic device coupled to the substrate, wherein the electronic device comprises:
 a top side; and 
 side edges; 
   a first conductive structure coupled to the substrate and laterally surrounding the side edges of the electronic device without a break;   a dielectric structure over the first conductive structure; and   a second conductive structure over the dielectric structure;   wherein:
 the first conductive structure provides a first capacitive plate; 
 the dielectric structure provides a capacitor dielectric; 
 the second conductive structure provides a second capacitive plate; and 
 the first capacitive plate, the capacitor dielectric, and the second capacitive plate form a capacitor structure for the packaged electronic device. 
   
     
     
         17 . The packaged electronic device of  claim 16 , wherein:
 the substrate comprises a peripheral edge;   the first conductive structure, the dielectric structure, and the second conductive structure comprise a ring-like stiffener proximate to the peripheral edge; and   the ring-like stiffener laterally surrounds the side edges of the electronic device without overlapping the top side of the electronic device.   
     
     
         18 . The packaged electronic device of  claim 17 , wherein:
 the first conductive structure comprises a first end coupled to the substrate and an opposing second end distal to the substrate;   the dielectric structure is over the opposing second end;   the second conductive structure comprises a first side generally perpendicular to the opposing second end;   a first portion of the first side is over the dielectric structure; and   a second portion of the first side coupled to the substrate.   
     
     
         19 . The packaged electronic device of  claim 16 , wherein:
 the first conductive structure comprises a first portion coupled to the substrate and a second portion coupled to the first portion; and   the second portion is coupled to the top side of the electronic device with an attachment material.   
     
     
         20 . The packaged electronic device of  claim 16 , wherein:
 the packaged electronic device is devoid of encapsulant material between the first conductive structure and the side edges of the electronic device.