Electronic device and manufacturing method thereof

Abstract

An electronic device and a manufacturing method thereof are disclosed. The electronic device includes a substrate, an electronic element, a barrier layer, a light absorbing layer, and a filter layer. The electronic element is disposed on the substrate. The barrier layer is disposed on the substrate and surrounds a side surface of the electronic element. The light absorbing layer is disposed on the barrier layer. The filter layer is disposed on the electronic element.

What is claimed is: 
     
         1 . An electronic device comprising:
 a substrate;   an electronic element disposed on the substrate;   a barrier layer disposed on the substrate and surrounding a side surface of the electronic element;   a light absorbing layer disposed on the barrier layer; and   a filter layer disposed on the electronic element.   
     
     
         2 . The electronic device according to  claim 1 , wherein the substrate comprises a bonding pad, the electronic element is electrically connected to the bonding pad, and a portion of the light absorbing layer is disposed on the bonding pad. 
     
     
         3 . The electronic device according to  claim 1 , further comprising:
 a filler layer disposed between the electronic element and the barrier layer, and disposed between the electronic element and the substrate.   
     
     
         4 . The electronic device according to  claim 3 , wherein a portion of the filter layer is disposed on the filler layer. 
     
     
         5 . The electronic device according to  claim 1 , wherein the electronic element is a light-emitting diode. 
     
     
         6 . The electronic device according to  claim 1 , further comprising:
 a light conversion layer disposed between the electronic element and the filter layer.   
     
     
         7 . The electronic device according to  claim 1 , wherein the filter layer comprises a curved surface. 
     
     
         8 . The electronic device according to  claim 7 , wherein the light absorbing layer comprises a flat surface. 
     
     
         9 . The electronic device according to  claim 1 , wherein the light absorbing layer comprises a curved surface. 
     
     
         10 . The electronic device according to  claim 1 , wherein a thickness of the light absorbing layer is 0.1 micrometer to 5 micrometers. 
     
     
         11 . A manufacturing method of an electronic device, the method comprising:
 providing a substrate;   disposing an electronic element on the substrate;   forming a barrier layer on the substrate, such that the barrier layer surrounds a side surface of the electronic element;   forming a light absorbing layer on the barrier layer; and   forming a filter layer on the electronic element.   
     
     
         12 . The manufacturing method according to  claim 11 , wherein the substrate comprises a bonding pad, and the method further comprises:
 disposing a portion of the light absorbing layer on the bonding pad.   
     
     
         13 . The manufacturing method according to  claim 11 , further comprising:
 forming a filler layer between the electronic element and the substrate, and forming the filler layer between the electronic element and the barrier layer.   
     
     
         14 . The manufacturing method according to  claim 13 , further comprising:
 forming a portion of the filter layer on the filler layer.   
     
     
         15 . The manufacturing method according to  claim 11 , wherein forming the light absorbing layer precedes forming the filter layer. 
     
     
         16 . The manufacturing method according to  claim 11 , further comprising:
 forming a light conversion layer between the electronic element and the filter layer.   
     
     
         17 . The manufacturing method according to  claim 16 , wherein forming the light conversion layer precedes forming the filter layer. 
     
     
         18 . The manufacturing method according to  claim 11 , wherein each of the light absorbing layer and the filter layer are formed through a photolithography process. 
     
     
         19 . The manufacturing method according to  claim 11 , wherein each of the light absorbing layer and the filter layer are formed through a printing process. 
     
     
         20 . The manufacturing method according to  claim 11 , wherein the light absorbing layer is formed through a photolithography process, and the filter layer is formed through a printing process.