Heat dissipation structure and electronic device adopting the same

Abstract

A heat dissipation structure adapted to dissipate heat from a heat-generating structure includes a heat dissipation unit and a liquid metal layer. The heat dissipation unit includes a heat dissipation body and an anti-corrosion metal layer formed on the heat dissipation body. The liquid metal layer is disposed between the heat-generating structure and the anti-corrosion metal layer, and is opposite to the heat dissipation body. An electronic device that adopts the heat dissipation structure is also disclosed.

What is claimed is: 
     
         1 . An electronic device ( 3 ), comprising:
 a heat-generating structure ( 2 ) including a substrate ( 21 ) and an electronic component ( 22 ) disposed on said substrate ( 21 );   a heat dissipation structure ( 1 ) including
 a heat dissipation unit ( 12 ) that includes a heat dissipation body ( 121 ) and an anti-corrosion layer ( 122 ) formed on said heat dissipation body ( 121 ), and 
 a liquid metal layer ( 11 ) disposed between said electronic component ( 22 ) and said anti-corrosion layer ( 122 ) and opposite to said heat dissipation body ( 121 ); and 
   an insulation layer ( 31 ) that is disposed on said substrate ( 21 ) and that surrounds said electronic component ( 22 ).   
     
     
         2 . The electronic device ( 3 ) as claimed in  claim 1 , wherein said heat-generating structure ( 2 ) further includes at least one electronic element ( 23 ) that is disposed on said substrate ( 21 ) , that is located between said electronic component ( 22 ) and said blocking member ( 13 ), and that is encapsulated by said insulation layer ( 31 ). 
     
     
         3 . The electronic device ( 3 ) as claimed in claim  1 , wherein said anti-corrosion layer ( 122 ) is made of metal or ceramic. 
     
     
         4 . The electronic device ( 3 ) as claimed in  claim 1 , wherein said heat dissipation body ( 121 ) is made of copper, aluminum, or alloys thereof.