Cleaning compositions and methods of use thereof

Abstract

The present disclosure relates to cleaning compositions that can be used to clean semiconductor substrates. These cleaning compositions can be used to remove defects arising from previous processing steps on these semiconductor substrates. These cleaning compositions can remove the defects/contaminants from the semiconductor substrates and thereby make the substrates appropriate for further processing. The cleaning compositions described herein primarily contain at least one organic acid and at least one anionic polymer.

What is claimed is: 
     
         1 . A cleaning composition comprising:
 at least one first organic acid;   at least one second organic acid different from the at least one first organic acid, the at least one second organic acid comprising a dienoic acid;   at least one anionic polymer; and   water;   wherein the composition has a pH of from about 0.1 to about 7.