Method for polishing substrate including functional chip

Abstract

To terminate polishing at an appropriate position, an end point position of the polishing is sensed. According to one embodiment, a method that chemomechanically polishes a substrate including a functional chip is provided. The method includes: a step of disposing the functional chip on the substrate; a step of disposing an end point sensing element on the substrate; a step of sealing the substrate on which the functional chip and the end point sensing element are disposed with an insulating material; a step of polishing the insulating material; and a step of sensing an end point of the polishing based on the end point sensing element while the insulating material is polished.

What is claimed is: 
     
         1 . A substrate comprising:
 a functional chip;   an insulating material that covers the functional chip; and   an end point sensing element.   
     
     
         2 . The substrate according to  claim 1 , wherein 
 the end point sensing element includes a reflection element.   
     
     
         3 . The substrate according to  claim 1 , wherein 
 the end point sensing element is fixed to a top surface of the functional chip with an adhesive.   
     
     
         4 . The substrate according to  claim 1 , wherein 
 the end point sensing element includes a dummy element unrelated to a function configured on the substrate.   
     
     
         5 . The substrate according to  claim 1 , wherein 
 a metal layer is formed on the insulating material.