Cmp polisher head over-rotation restrictor

Abstract

A CMP tool including a polisher head with an over-rotation restrictor mechanism is operative to counteract a rotational difference between an inner body of the polisher head and an outer body of the polisher head that are coupled by a rolling seal. In one arrangement, the over-rotation restrictor mechanism comprises a plurality of rotation lock pins provided with a rotational component of the polisher head, e.g., the outer body, and a corresponding plurality of restrictor receptacles provided with another rotational component of the polisher head, e.g., the inner body, wherein the rotation lock pins may be engaged with respective restrictor receptacles for arresting the rotational difference between the two rotational components.

What is claimed is: 
     
         1 . A chemical-mechanical planarization (CMP) polisher head, comprising:
 an inner body configured to be driven around a rotational axis, the inner body including an annular rolling seal affixed proximate to a bottom terminus of the inner body; and   an outer body disposed in a rotational union with the inner body along the rotational axis by engaging in a compressive arrangement with the annular rolling seal, wherein a plurality of rotation lock pins are fastened to an inner wall of the outer body, the plurality of rotation lock pins configured to engage with a corresponding plurality of slots disposed on an outer wall of the inner body, the plurality of rotation pins operating to arrest a rotational difference between the inner body and the outer body during a polishing operation of a top surface of a semiconductor process wafer.   
     
     
         2 . The CMP polisher head as recited in  claim 1 , wherein the plurality of rotation lock pins are symmetrically positioned along a circular perimeter of the inner wall of the outer body. 
     
     
         3 . The CMP polisher head as recited in  claim 1 , wherein the plurality of rotation lock pins each comprise a threaded portion and a non-threaded portion, the threaded portion configured to fasten into the inner wall of the outer body and the non-threaded portion having a form factor configured to engage with a corresponding slot in the inner body. 
     
     
         4 . The CMP polisher head as recited in  claim 1 , wherein the plurality of slots each comprise a recess having a cross-sectional area with two opposing sidewalls, the cross-sectional area dimensioned to accept a corresponding rotation lock pin of the outer body. 
     
     
         5 . The CMP polisher head as recited in  claim 4 , wherein at least one of the two opposing sidewalls of a slot comprises a sloped wall. 
     
     
         6 . The CMP polisher head as recited in  claim 4 , wherein at least one of the two opposing sidewalls of a slot comprises a vertical wall. 
     
     
         7 . The CMP polisher head as recited in  claim 4 , wherein at least one of the two opposing sidewalls of a slot comprises a curvilinear wall. 
     
     
         8 . The CMP polisher head as recited in  claim 1 , wherein the inner body includes a plurality of apertures configured to support tubing for facilitating multi-zonal control of a membrane affixed to a retainer ring coupled to the outer body, the membrane operative to pneumatically attach to a backside of the semiconductor process wafer. 
     
     
         9 . A chemical-mechanical planarization (CMP) tool, comprising:
 a CMP polisher head configured to rotate around a first rotational axis;   a platen having a polishing pad disposed thereon, the platen configured to rotate around a second rotational axis; and   a slurry dispenser positioned proximate to the platen, the slurry dispenser operative to controllably deliver a slurry material on the polishing pad, wherein the CMP polisher head comprises:
 a first rotational component having a flange for mounting to a spindle driven by a motor around the first rotational axis, the first rotational component having a rolling seal affixed proximate to a bottom terminus thereof; and 
 a second rotational component axially aligned with the first rotational component along the first rotational axis, the second rotational component attached to the first rotational component by engaging in a compressive arrangement with the rolling seal, wherein a plurality of rotation lock pins and a corresponding plurality of restrictor receptacles are provided with the first and second rotational components such that the plurality of rotation pins and the plurality of restrictor receptacles operate, when respectively engaged, to arrest a rotational difference between the first and second rotational components during a polishing operation of a top surface of a semiconductor process wafer by the polishing pad disposed on the platen. 
   
     
     
         10 . The CMP tool as recited in  claim 9 , wherein the plurality of rotation lock pins are positioned along a circular perimeter of an inner wall of the second rotational component and the corresponding plurality of receptacles are positioned in an outer wall of the first rotational component. 
     
     
         11 . The CMP tool as recited in  claim 9 , wherein the plurality of rotation lock pins are positioned along a circular perimeter of an outer wall of the first rotational component and the corresponding plurality of restrictor receptacles are positioned in an inner wall of the second rotational component. 
     
     
         12 . The CMP tool as recited in  claim 9 , wherein the plurality of rotation lock pins each comprise a threaded portion and a non-threaded portion, the threaded portion configured to fasten into a wall portion of the first rotational component or the second rotational component and the non-threaded portion having a form factor configured to engage with a corresponding one of the plurality of restrictor receptacles. 
     
     
         13 . The CMP tool as recited in  claim 8 , wherein the plurality of restrictor receptacles each comprise a recess having a cross-sectional area with two opposing sidewalls, the cross-sectional area dimensioned to accept a corresponding rotation lock pin. 
     
     
         14 . The CMP tool as recited in  claim 13 , wherein at least one of the two opposing sidewalls of a restrictor receptacle comprises a sloped wall. 
     
     
         15 . The CMP tool as recited in  claim 13 , wherein at least one of the two opposing sidewalls of a restrictor receptacle comprises a vertical wall. 
     
     
         16 . The CMP tool as recited in  claim 13 , wherein at least one of the two opposing sidewalls of a restrictor receptacle comprises a curvilinear wall. 
     
     
         17 . The CMP tool as recited in  claim 9 , wherein the first rotational component includes a plurality of apertures configured to support tubing for facilitating multi-zonal control of a membrane affixed to a retainer ring coupled to the second rotational component, the membrane operative to pneumatically attach to a backside of the semiconductor process wafer. 
     
     
         18 . A chemical-mechanical planarization (CMP) polisher head, comprising:
 an inner body configured to be driven around a rotational axis, the inner body including an annular rolling seal affixed proximate to a bottom terminus of the inner body;   an outer body disposed in a rotational union with the inner body along the rotational axis; and   a plurality of rotation lock pins engaged with a corresponding plurality of restrictor receptacles to arrest a rotational difference between the inner body and the outer body, the plurality of rotation lock pins and the corresponding plurality of restrictor receptacles disposed between the inner body and the outer body.   
     
     
         19 . The CMP polisher head as recited in  claim 18 , wherein the plurality of rotation lock pins are symmetrically positioned along a circular perimeter of an inner wall of the outer body and the corresponding plurality of restrictor receptacles are disposed on an outer wall of the inner body. 
     
     
         20 . The CMP polisher head as recited in  claim 18 , wherein the plurality of rotation lock pins are symmetrically positioned along a circular perimeter of an outer wall of the inner body and the corresponding plurality of restrictor receptacles are disposed on an inner wall of the outer body.