Fan-out light-emitting diode (led) device substrate with embedded backplane, lighting system and method of manufacture

Abstract

Panels of LED arrays and LED lighting systems are described. A panel includes a substrate having a top and a bottom surface. Multiple backplanes are embedded in the substrate, each having a top and a bottom surface. Multiple first electrically conductive structures extend at least from the top surface of each of the backplanes to the top surface of the substrate. Each of multiple LED arrays is electrically coupled to at least some of the first conductive structures. Multiple second conductive structures extend from each of the backplanes to at least the bottom surface of the substrate. At least some of the second electrically conductive structures are coupled to at least some of the first electrically conductive structures via the backplane. A thermal conductive structure is in contact with the bottom surface of each of the backplanes and extends to at least the bottom surface of the substrate.

What is claimed is: 
     
         1 . A panel of light-emitting diode (LED) arrays, the panel comprising:
 a substrate having a top surface and a bottom surface;   a plurality of backplanes embedded in the substrate, each of the plurality of backplanes having a top surface and a bottom surface;   a plurality of arrays of first electrically conductive structures extending at least from the top surface of each of the plurality of backplanes to the top surface of the substrate;   a plurality of LED arrays, each electrically coupled to one of the plurality of arrays of first electrically conductive structures;   a plurality of second electrically conductive structures extending from each of the plurality of backplanes to at least the bottom surface of the substrate, at least some of the second electrically conductive structures electrically coupled to at least one of the plurality of LED arrays; and   a plurality of thermal conductors, at least one of the plurality of thermal conductors in contact with the bottom surface of one of the plurality of backplanes and extending to at least the bottom surface of the substrate.