In-body power source having high surface area electrode

Abstract

Power sources that enable in-body devices, such as implantable and ingestible devices, are provided. Aspects of the in-body power sources of the invention include a solid support, a first high surface area electrode and a second electrode. Embodiments of the in-power sources are configured to emit a detectable signal upon contact with a target physiological site. Also provided are methods of making and using the power sources of the invention.

1 .- 25 . (canceled) 
     
     
         26 . A method of producing an identifier, the method comprising:
 providing an electroplating bath with an electroplating solution;   including one or more additives in the electroplating solution;   depositing a metal onto a first surface of a solid support, in the electroplating bath at a mass-transfer limit of the metal;   wherein the one or more additives in the electroplating solution is to generate a desired porosity of the metal when deposited on the first surface;   wherein the metal deposited onto the first surface produces a porous under-layer at the desired porosity to provide a surface area enhancement;   depositing a first active electrode material on the porous under-layer;   depositing a second active electrode material on a second surface of the solid support opposite the first surface, wherein the second active electrode material is different from the first active electrode material;   wherein the first and second active electrode materials provide a voltage potential difference to a circuitry element via completion of a battery when the first and second active electrode materials contact an electrically conductive fluid within a body;   wherein the identifier is configured to communicate a conductively transmitted signal that employs the body as a conduction medium; and   wherein upon application of the voltage potential difference to the circuitry element, the circuitry element is configured to generate the conductively transmitted signal such that the conductively transmitted signal is conducted between the circuitry element and a receiver through tissues of the body.   
     
     
         27 . The method of  claim 26 , wherein the one or more additives includes an acid. 
     
     
         28 . The method of  claim 26 , wherein the one or more additives includes a polymer. 
     
     
         29 . The method of  claim 28 , wherein the polymer is biocompatible such that the polymer is capable of coexistence with living tissues without causing harm. 
     
     
         30 . The method of  claim 28 , wherein the polymer is non-immunogenic such that the polymer is does not produce an immune response in the body. 
     
     
         31 . The method of  claim 28 , wherein the polymer is a polyethylene glycol (PEG). 
     
     
         32 . The method of  claim 26 , wherein the one or more additives includes an alcohol. 
     
     
         33 . The method of  claim 26 , wherein the one or more additives includes an accelerator to accelerate a deposition rate of the metal. 
     
     
         34 . The method of  claim 26 , wherein the one or more additives includes a suppressing additive to physically block the metal from depositing on at least some of the solid support. 
     
     
         35 . The method of  claim 26 , wherein the one or more additives includes a suppressing additive and an accelerator to accelerating additive to accelerate a deposition rate of the metal and to dislodge the suppressing additive from the solid support. 
     
     
         36 . The method of  claim 26 , wherein the electroplating solution is selected to cause the metal to be deposited onto the first surface in a dendritic form. 
     
     
         37 . The method of  claim 26 , further comprising producing a co-evolution of gas into the electroplating bath to produce blocking gas bubbles at the first surface of the solid support. 
     
     
         38 . The method of  claim 37 , further comprising employing a surface tension agent to control a size of the blocking gas bubbles. 
     
     
         39 . The method of  claim 37 , Wherein the one or more additives includes an accelerating agent to act in conjunction with the blocking gas bubbles in the electroplating bath. 
     
     
         40 . The method of  claim 26 , further comprising producing a self-assembled monolayer of an organic, diazonium containing species that bonds to the first surface of the solid support to physically block the metal from at least some of the solid support. 
     
     
         41 . The method of  claim 26 , wherein the metal is a first metal, and the method further comprises simultaneously depositing a second metal onto the solid support along with the first metal. 
     
     
         42 . The method of  claim 41 , further comprising immersing the solid support into an electrolytic solution that causes the second metal to dissolve away, leaving behind a film of the first metal on the solid support. 
     
     
         43 . The method of  claim 26 , further comprising modifying the solid support to electrically remove at least some of the metal from the solid support.