Device comprising multi-directional antennas in substrates coupled through flexible interconnects

Abstract

A device that includes a first substrate comprising a first antenna, an integrated device coupled to the first substrate, an encapsulation layer located over the first substrate and the integrated device, a second substrate comprising a second antenna, and a flexible connection coupled to the first substrate and the second substrate. The device includes a shield formed over a surface of the encapsulation layer and a surface of the first substrate. The shield includes an electromagnetic interference (EMI) shield.

1 . A device comprising:
 a first substrate comprising a first antenna;   an integrated device coupled to the first substrate;   an encapsulation layer located over the first substrate and the integrated device, wherein the encapsulation layer encapsulates the integrated device;   a connector coupled to the first substrate and configured to provide one or more external input/output terminals;   a second substrate comprising a second antenna; and   a flexible connection coupled to the first substrate and the second substrate, wherein the flexible connection is embedded in the first substrate and the second substrate.   
     
     
         2 . The device of  claim 1 ,
 wherein the first substrate includes a first plurality of antennas,   wherein the first plurality of antennas are embedded in the first substrate,   wherein each antenna from the first plurality of antennas is adjacent to another antenna from the first plurality of antennas, and   wherein the first antenna is an antenna from the first plurality of antennas.   
     
     
         3 . The device of  claim 1 ,
 wherein the second substrate includes a second plurality of antennas,   wherein the second plurality of antennas are embedded in the second substrate,   wherein each antenna from the second plurality of antennas is adjacent to another antenna from the second plurality of antennas, and   wherein the second antenna is an antenna from the second plurality of antennas.   
     
     
         4 . The device of  claim 1 ,
 wherein the first substrate comprises a plurality of interconnects, and   wherein the connector is coupled to one or more interconnects from the plurality of interconnects of the first substrate.   
     
     
         5 . The device of  claim 4 , wherein the connector is coupled to the integrated device through the one or more interconnects from the plurality of interconnects of the first substrate. 
     
     
         6 . The device of  claim 1 , wherein the integrated device and the connector are coupled to a first surface of the first substrate. 
     
     
         7 . The device of  claim 6 ,
 wherein the first antenna is configured to face towards a second surface of the first substrate, and   wherein the second surface of the first substrate is opposite to the first surface of the first substrate.   
     
     
         8 . The device of  claim 1 , wherein the connector is external to the encapsulation layer that encapsulates the integrated device. 
     
     
         9 . The device of  claim 1 , wherein the flexible connection comprises:
 at least one dielectric layer;   at least one interconnect; and   a protective material that covers the at least one dielectric layer and the at least one interconnect.   
     
     
         10 . The device of  claim 9 , wherein the at least one dielectric layer and the at least one interconnect of the flexible connection, extend into the first substrate and the second substrate. 
     
     
         11 . The device of  claim 1 , further comprising a shield located over a surface of the encapsulation layer, wherein the shield is configured as an electromagnetic interference (EMI) shield. 
     
     
         12 . The device of  claim 1 ,
 wherein the first antenna is embedded in the first substrate,   wherein the first substrate is configurable to face a first antenna direction,   wherein the second antenna is embedded in the second substrate, and   wherein the second substrate is configurable to face a second antenna direction.   
     
     
         13 . The device of  claim 1 , wherein the flexible connection is coupled to a length side of the first substrate and a length side of the second substrate. 
     
     
         14 . The device of  claim 1 , wherein the flexible connection is coupled to a length side of the first substrate and a width side of the second substrate. 
     
     
         15 . The device of  claim 1 , wherein the flexible connection is coupled to a width side of the first substrate and a length side of the second substrate. 
     
     
         16 . The device of  claim 1 , wherein the flexible connection is coupled to a width side of the first substrate and a width side of the second substrate. 
     
     
         17 . A method for fabricating a device, comprising:
 providing a substrate comprising a first antenna and a second antenna;   removing portions of the substrate to define (i) a first substrate comprising the first antenna, (ii) a second substrate comprising the second antenna, and (iii) a flexible connection coupled to the first substrate and the second substrate, wherein the flexible connection is embedded in the first substrate and the second substrate;   coupling an integrated device to the first substrate;   forming an encapsulation layer over the first substrate and the integrated device; and   coupling a connector to the first substrate, wherein the connector is configured to provide one or more external input/output terminals.   
     
     
         18 . The method of  claim 17 ,
 wherein the first substrate includes a first plurality of antennas,   wherein the first plurality of antennas are embedded in the first substrate,   wherein each antenna from the first plurality of antennas is adjacent to another antenna from the first plurality of antennas,   wherein the first antenna is an antenna from the first plurality of antennas,   wherein the second substrate includes a second plurality of antennas,   wherein the second plurality of antennas are embedded in the second substrate,   wherein each antenna from the second plurality of antennas is adjacent to another antenna from the second plurality of antennas, and   wherein the second antenna is an antenna from the second plurality of antennas.   
     
     
         19 . The method of  claim 17 ,
 wherein the first substrate comprises a plurality of interconnects,   wherein the connector is coupled to one or more interconnects from the plurality of interconnects of the first substrate,   wherein the connector is coupled to the integrated device through the one or more interconnects from the plurality of interconnects of the first substrate,   wherein the integrated device and the connector are coupled to a first surface of the first substrate,   wherein the first antenna is configured to face towards a second surface of the first substrate, and   wherein the second surface of the first substrate is opposite to the first surface of the first substrate.   
     
     
         20 . The method of  claim 17 ,
 wherein the first antenna is embedded in the first substrate,   wherein the first substrate is configurable to face a first antenna direction,   wherein the second antenna is embedded in the second substrate,   wherein the second substrate is configurable to face a second antenna direction, and   wherein the flexible connection comprises: 
 at least one dielectric layer; 
 at least one interconnect; and 
 wherein the at least one dielectric layer and the at least one interconnect of the flexible connection, extend into the first substrate and the second substrate.