US2023142465A1PendingUtilityA1

Led assembly with omnidirectional light field

Assignee: EPISTAR CORPPriority: Jun 27, 2013Filed: Dec 30, 2022Published: May 11, 2023
Est. expiryJun 27, 2033(~6.9 yrs left)· nominal 20-yr term from priority
H10W 74/00H10W 72/884H10W 90/754H10W 72/547H10W 72/07554H10W 72/536H10W 90/753H10W 90/00H10W 72/353H10W 72/354H10W 72/325H10W 90/734H10H 20/851H05K 3/326F21K 9/232F21Y 2103/10F21V 19/003F21Y 2107/00H05K 3/366H05K 3/285H05K 1/117F21K 9/90F21K 9/00H05K 3/3405H05K 2201/09481F21Y 2115/10F21Y 2101/00H05K 2201/10674H01L 24/29H01L 33/50
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Claims

Abstract

An LED assembly includes an omnidirectional light field. The LED assembly has a transparent substrate with first and second surfaces facing to opposite orientations respectively. LED chips are mounted on the first surface and are electrically interconnected by a circuit. A transparent capsule with a phosphor dispersed therein is formed on the first surface and substantially encloses the circuit and the LED chips. First and second electrode plates are formed on the first or second surface, and electrically connected to the LED chips.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A light-emitting diode assembly, comprising:
 a substrate, comprising:
 a top surface; 
 a bottom surface opposite to the top surface; and 
 a terminal portion; 
   a first electrically-conductive strip, located on the top surface;   a second electrically-conductive strip, located on the top surface, separated from the first electrically-conductive strip, and closer to the terminal portion than the second electrically-conductive strip;   a light-emitting diode chip, flipped to mount on the first electrically-conductive strip and the second electrically-conductive strip;   a transparent body, comprising a phosphor, located on the top surface, and covering the light-emitting diode chip and the first electrically-conductive strip;   a first electrode plate, located on the second electrically-conductive strip and electrically connected to the light-emitting diode chip; and   a phosphor layer, located under the bottom surface.   
     
     
         2 . The light-emitting diode assembly of  claim 1 , wherein the light-emitting diode chip is configured to emit a light which can pass through the substrate. 
     
     
         3 . The light emitting diode assembly of  claim 1 , wherein the transparent body and the phosphor layer have different thicknesses. 
     
     
         4 . The light-emitting diode assembly of  claim 1 , wherein the transparent body covers a portion of the second electrically-conductive strip. 
     
     
         5 . The light-emitting diode assembly of  claim 1 , further comprising a second electrode plate located under the bottom surface, and electrically connected to the first electrode plate without contacting the phosphor layer. 
     
     
         6 . The light-emitting diode assembly of  claim 1 , wherein the substrate further comprises a side surface located between the top surface and the bottom surface without being covered by the transparent body and the phosphor layer. 
     
     
         7 . The light-emitting diode assembly of  claim 1 , wherein the second electrically-conductive strip comprises two portions with different widths. 
     
     
         8 . The light emitting diode assembly of  claim 1 , wherein the substrate does not comprise any through hole. 
     
     
         9 . The light-emitting diode assembly of  claim 1 , wherein the second electrically-conductive strip has a thickness smaller than that of the first electrode plate. 
     
     
         10 . A light bulb, comprising:
 a light-emitting diode assembly of  claim 1 ;   a lamp shell, covering the light-emitting diode assembly; and   an electrical connection structure, associated with the lamp shell.

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