System-in-package and aerosol generating apparatus comprising the same

Abstract

An aerosol-generating apparatus includes a heater assembly configured to heat a cigarette inserted into the aerosol-generating apparatus, a battery configured to supply power to the heater assembly, and a system-in-package (SIP) including a microcontroller unit (MCU); a sensor module; and a heating integrated circuit (IC) configured to control a heating operation of the heater assembly.

What is claimed is: 
     
         1 . A system-in-package (SIP) for an aerosol generating apparatus, comprising:
 a microcontroller unit (MCU);   a sensor module; and   a heating integrated circuit (IC) configured to control a heating operation of a heater assembly included in the aerosol generating apparatus.   
     
     
         2 . The SIP of  claim 1 , wherein the MCU is configured to control the heating IC to stop the heating operation based on impurities being detected from a molding of the SIP by the sensor, and control the heating IC to resume the heating operation of the heater assembly when no impurities are detected from the molding. 
     
     
         3 . The SIP of  claim 2 , wherein the MCU is configured to control the heating IC to stop the heating operation based on an amount of the impurities detected by the sensor module being greater than a preset threshold value. 
     
     
         4 . The SIP of  claim 1 , wherein the MCU is configured to control the heating IC to stop the heating operation based on a temperature of at least one component of the SIP detected by the sensor module being greater than a preset threshold value. 
     
     
         5 . The SIP of  claim 1 , wherein the MCU is configured to control the heating IC to stop the heating operation based on a sum of temperatures of respective components of the SIP being greater than a preset threshold value. 
     
     
         6 . The SIP of  claim 1 , wherein a molding of the SIP is arranged to cover at least part of an exterior of the SIP to dissipate internal heat of the SIP. 
     
     
         7 . The SIP of  claim 1 , wherein the SIP is stacked on at least part of a battery or arranged alongside the battery. 
     
     
         8 . The SIP of  claim 1 , wherein the MCU, the heating IC, and the sensor module are packaged by wafer-level packaging (WLP). 
     
     
         9 . An aerosol-generating apparatus comprising:
 a heater assembly configured to heat a cigarette inserted into the aerosol-generating apparatus;   a battery configured to supply power to the heater assembly; and   a system-in-package (SIP) comprising:
 a microcontroller unit (MCU); 
 a sensor module; and 
 a heating integrated circuit (IC) configured to control a heating operation of the heater assembly. 
   
     
     
         10 . The aerosol-generating apparatus of  claim 9 , wherein the MCU is configured to control the heating IC to stop the heating operation based on impurities being detected from a molding of the SIP by the sensor module, and control the heating IC to resume the heating operation of the heater assembly when no impurities are detected from the molding. 
     
     
         11 . The aerosol-generating apparatus of  claim 10 , wherein the MCU is configured to control the heating IC to stop the heating operation based on a temperature of at least one component of the SIP detected by the sensor module being greater than a preset threshold value. 
     
     
         12 . The aerosol-generating apparatus of  claim 9 , wherein the MCU is configured to control the heating IC to stop the heating operation based on a temperature of at least one component of the SIP detected by the sensor module being greater than a preset threshold value. 
     
     
         13 . The aerosol-generating apparatus of  claim 9 , wherein the MCU is configured to control the heating IC to stop the heating operation based on a sum of temperatures of respective components of the SIP being greater than a preset threshold value. 
     
     
         14 . The aerosol-generating apparatus of  claim 9 , wherein a molding of the SIP is arranged to cover at least part of an exterior of the SIP to dissipate internal heat of the SIP. 
     
     
         15 . The aerosol-generating apparatus of  claim 9 , wherein the SIP is stacked on at least part of the battery or arranged alongside the battery.