ADVANCED BARRIER NICKEL OXIDE (BNiO) COATING DEVELOPMENT FOR THE PROCESS CHAMBER COMPONENTS

Abstract

Described herein is a chamber component including a metal layer comprising nickel and a barrier layer of nickel oxide over the metal layer. The barrier layer of nickel oxide may be formed by treating the chamber component with an oxidizing agent comprising hydrofluoric acid and/or nitric acid

1 . A chamber component for a processing chamber, comprising:
 a body, wherein the body comprises aluminum, an aluminum alloy, aluminum nitride, alumina or combinations thereof;   a metal plating on at least one surface of the body, the metal plating comprising nickel; and   a barrier layer on the metal plating,   wherein the barrier layer comprises a nickel oxide and has a thickness of about 5 nanometers to about 35 nanometers.   
     
     
         2 . The chamber component of  claim 1 , wherein the metal plating comprises nickel and phosphorus. 
     
     
         3 . The chamber component of  claim 1 , wherein the metal plating comprises nickel and is free of phosphorous. 
     
     
         4 . (canceled) 
     
     
         5 . The chamber component of  claim 1 , wherein the metal plating has a thickness of about 20 microns to about 75 microns, and wherein the barrier layer has a thickness of about 2 nm to about 50 nm. 
     
     
         6 . The chamber component of  claim 1 , wherein the barrier layer has an average surface roughness (Ra) of about 2 micro-inches to about 60 micro-inches. 
     
     
         7 . The chamber component of  claim 1 , wherein the chamber component comprises a showerhead for a process chamber. 
     
     
         8 . A method of protecting a chamber component, comprising:
 forming a metal plating on a body of the chamber component, wherein the metal plating comprises nickel, and   contacting the metal plating with an oxidizing agent to form a barrier layer on the metal plating, wherein the barrier layer comprises nickel oxide.   
     
     
         9 . The method of  claim 8 , wherein the oxidizing agent comprises at least one of hydrofluoric acid, oxalic acid, or nitric acid. 
     
     
         10 . The method of  claim 8 , wherein the barrier layer has a thickness from about 2 μm to about 60 μm. 
     
     
         11 . The method of  claim 8 , wherein forming the metal plating comprises performing electroless metal plating, and wherein the metal plating further comprises phosphorus. 
     
     
         12 . The method of  claim 8 , wherein the body comprises an aluminum alloy, aluminum nitride, alumina, or combinations thereof. 
     
     
         13 . The method of  claim 8 , further comprising:
 removing a native oxide from the metal plating prior to forming the barrier layer.   
     
     
         14 . The method of  claim 8 , further comprising after the forming the metal playing, forming a nickel fluoride (NiF2) or nickel oxy-fluoride layer on the metal plating by contacting the metal plating with ammonium fluoride. 
     
     
         15 . The method of  claim 8 , further comprising:
 placing the chamber component in an acid bath comprising 5-25% hydrofluoric acid and 75-95% water to contact the metal plating with the oxidizing agent;   subsequently placing the chamber component in a de-ionized water bath;   subsequently placing the chamber component in the acid bath; and   subsequently placing the chamber in the di-ionized water bath.   
     
     
         16 . A method of refurbishing a used chamber component, comprising:
 removing a contamination layer from a metal plating on the used chamber component using a first acid solution, wherein the metal plating comprises nickel; and   subsequently contacting the metal plating with an oxidizing agent to form a barrier layer on the metal plating, wherein the barrier layer comprises nickel oxide.   
     
     
         17 . The method of  claim 16 , wherein the contamination layer comprises nickel fluoride. 
     
     
         18 . The method of  claim 16 , wherein the removing the contamination layer comprises:
 placing the used chamber component in a first acid bath,   subsequently rinsing the used chamber component with deionized water,   subsequently drying the used chamber component,   subsequently placing the used chamber component in a second acid bath,   subsequently rinsing the used chamber component with deionized water, and   subsequently drying the used chamber component.   
     
     
         19 . The method of  claim 16 , wherein the oxidizing agent comprises at least one of hydrofluoric acid or nitric acid. 
     
     
         20 . The method of  claim 16 , wherein the barrier layer has a thickness from about 2 μm to about 60 μm.