US2023092667A1PendingUtilityA1
Method of manufacturing printed circuit board and resist laminate for the same
Est. expirySep 23, 2041(~15.2 yrs left)· nominal 20-yr term from priority
C25D 5/022C25D 5/56C25D 7/00C23C 18/1653H05K 3/108H05K 2201/09845H05K 2203/0577G03F 7/164H05K 3/064H05K 3/062G03F 7/0035C25D 3/38C25D 5/48G03F 7/11
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Claims
Abstract
A method of manufacturing a printed circuit board a includes preparing an insulating substrate on which a first metal layer is formed, stacking a resist laminate having a plurality of layers on the first metal layer, forming an opening exposing a portion of the first metal layer by patterning the stacked resist laminate having the plurality of layers, forming a second metal layer on the exposed portion of the first metal layer, removing the patterned resist laminate having the plurality of layers, and etching at least another portion of the first metal layer.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A resist laminate comprising:
a first resist layer of non-photosensitivity including an acrylic resin; and a photosensitive second resist layer disposed on the first resist layer.
2 . The resist laminate of claim 1 , wherein the photosensitive second resist layer is a negative type.Join the waitlist — get patent alerts
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