Display panel and method of fabricating the same
Abstract
A display panel includes a base layer having a first region and a bent second region. An inorganic layer is disposed on the base layer. A lower groove is formed within the inorganic layer and overlaps the second region. A first thin-film transistor is disposed on the inorganic layer and includes a silicon semiconductor pattern overlapping the first region. A second thin-film transistor is disposed on the inorganic layer and includes an oxide semiconductor pattern overlapping the first region. Insulating layers overlap the first and second regions. An upper groove is formed within the insulating layers. A signal line electrically connects the second thin-film transistor. An organic layer overlaps the first and second regions and is disposed in the lower and upper grooves. A luminescent device is disposed on the organic layer and overlaps the first region.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A display panel, comprising:
a base layer including a first region and a second region that is bent with respect to the first region; at least one inorganic layer overlapping both the first region and the second region and disposed on the base layer; a first thin-film transistor disposed on the at least one inorganic layer and including a silicon semiconductor pattern overlapping the first region; a second thin-film transistor disposed on the at least one inorganic layer and including an oxide semiconductor pattern overlapping the first region, wherein the oxide semiconductor pattern is disposed on a layer different from the silicon semiconductor pattern; a plurality of insulating layers overlapping both the first region and the second region; a signal line electrically connected to the second thin-film transistor; an organic layer overlapping both the first region; and a luminescent element disposed on the organic layer and overlapping the first region, and wherein an opening is defined in the at least one inorganic layer and the plurality of insulation layers and the opening is positioned in the second region.Join the waitlist — get patent alerts
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