Electronic package

Abstract

An electronic package is provided and uses a plurality of bonding wires as a shielding structure. The bonding wires are stitch bonded onto a carrier carrying electronic components, such that the problem of the shielding structure peeling off or falling off from the carrier can be avoided due to the fact that the bonding wires are not affected by temperature, humidity and other environmental factors.

1 . An electronic package, comprising:
 a carrier;   an electronic component disposed on the carrier; and   a shielding structure including a plurality of bonding wire portions, each of the bonding wire portions being provided on the carrier by continuous wire bonding, wherein the bonding wire portion has an arc line shape and is defined with a first line segment, a second line segment and a curved segment connected with the first line segment and the second line segment.   
     
     
         2 . The electronic package of  claim 1 , wherein a length of the first line segment and a length of the second line segment are not equal. 
     
     
         3 . The electronic package of  claim 1 , wherein the bonding wire portion is a single line segment. 
     
     
         4 . The electronic package of  claim 1 , wherein the shielding structure forms a closed loop. 
     
     
         5 . The electronic package of  claim 1 , further comprising a packaging layer encapsulating the electronic component and the shielding structure. 
     
     
         6 . The electronic package of  claim 5 , wherein the shielding structure is partially exposed from the packaging layer. 
     
     
         7 . The electronic package of  claim 5 , further comprising a shielding layer formed on the packaging layer. 
     
     
         8 . The electronic package of  claim 7 , wherein the shielding layer is electrically connected with the carrier. 
     
     
         9 . The electronic package of  claim 7 , wherein the shielding layer is in contact with the shielding structure. 
     
     
         10 . The electronic package of  claim 7 , wherein the shielding layer is not in contact with the shielding structure. 
     
     
         11 . The electronic package of  claim 1 , wherein all of the plurality of bonding wire portions are continuously wire bonded to integrally form the shielding structure. 
     
     
         12 .- 22 . (canceled)