Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers

Abstract

A semiconductor device with redistribution layers on partial encapsulation is disclosed and may include providing a carrier with a non-photosensitive protection layer, forming a pattern in the non-photosensitive protection layer, providing a semiconductor die with a contact pad on a first surface, and bonding the semiconductor die to the non-photosensitive protection layer such that the contact pad aligns with the pattern formed in the non-photosensitive protection layer. A second surface opposite to the first surface of the semiconductor die, side surfaces between the first and second surfaces of the semiconductor die, and a portion of a first surface of the non-photosensitive protection layer may be encapsulated with an encapsulant. The carrier may be removed leaving the non-photosensitive protection layer bonded to the semiconductor die. A redistribution layer may be formed on the contact pad and a second surface of the non-photosensitive protection layer opposite to the first surface.

1 . A method for manufacturing a semiconductor device, the method comprising:
 forming a pattern in a non-photosensitive protection layer;   providing a semiconductor die with a contact pad on a first surface;   bonding the semiconductor die to the non-photosensitive protection layer;   encapsulating a second surface opposite to the first surface of the semiconductor die; and   forming a redistribution layer on the contact pad and the non-photosensitive protection layer opposite to the first surface.   
     
     
         2 - 20 . (canceled)