Basic structural body for constructing heat dissipation device and heat dissipation device

Abstract

A basic structural body for constructing heat dissipation device and a heat dissipation device are disclosed. The heat dissipation device includes a first basic structural body having a wick structure formed on one side surface thereof; and the first basic structural body and the wick structure are structural bodies formed layer by layer. Two pieces of first basic structural bodies can be correspondingly closed together to construct a heat dissipation device internally defining an airtight chamber. In this manner, the heat dissipation device can be designed in a more flexible manner.

What is claimed is: 
     
         1 . A heat dissipation device, comprising:
 a plurality of first basic structural bodies, which respectively have a wick structure formed on one side surface thereof; the first basic structural body and the wick structure thereof being structural bodies formed layer by layer, and the basic structural bodies being correspondingly closed together in pairs to construct the heat dissipation device that internally defines an airtight chamber; and a working fluid being filled in the airtight chamber.   
     
     
         2 . The heat dissipation device as claimed in  claim 1 , wherein the first basic structural body is formed using a material selected from the group consisting gold, silver, copper, aluminum, titanium, stainless steel, ceramic, non-metal materials, and any combination thereof. 
     
     
         3 . The heat dissipation device as claimed in  claim 1 , wherein the heat dissipation device has an outlet and an inlet, which are connected to two opposite ends of a vapor and liquid pipe that is extended through a heat dissipation unit; and the vapor and liquid pipe and the heat dissipation unit being structural bodies formed layer by layer through 3D printing. 
     
     
         4 . The heat dissipation device as claimed in  claim 1 , wherein the wick structure is selected from the group consisting of a structural layer including one single porous body, a structural layer including a plurality of superimposed porous bodies, and a plurality of grooves formed between mutually spaced ribs; and is formed through a manner selected from the group consisting of  3 D printing, electroforming, electroplating, printing, and thermal spraying; and the porous body being selected from the group consisting of a powder-sintered body, a woven mesh, a fibrous member, and a structural body combining superimposed layers of powder-sintered body, woven mesh and fibrous member. 
     
     
         5 . The heat dissipation device as claimed in  claim 1 , wherein the wick structure is formed using a material selected from the group consisting of copper, aluminum, nickel, gold, silver, titanium, stainless steel, ceramic, plastic, and any combination thereof. 
     
     
         6 . The heat dissipation device as claimed in  claim 1 , further comprising a polymeric layer externally provided on one side of the heat dissipation device opposite to the wick structure; the polymeric layer being formed using a material selected from the group consisting of a natural polymer, a synthetic polymer and an inorganic polymer; the natural polymer being selected from the group consisting of starch, rubber and nucleic acid; the synthetic polymer being selected from the group consisting of polyethylene (PE), polyvinyl chloride (PVC), nylon, Dacron (polyethylene terephthalate or PET), acrylonitrile butadiene styrene (ABS), and styrene-butadiene rubber (SBR); and the inorganic polymer being selected from the group consisting of quartz, asbestos, mica and graphite.